Inventor · disambiguated record

Soutarou Ooi

Also filed as: OOI Soutarou

1 granted patent·2 citations·filing 2018–2018

18Inventor score

Technology areasH10W

Files withMITSUBISHI MATERIALS CORP1

Top patents by PatentIndex Score

1 record

0164US11478868B2Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 25, 2022·2 cites·11 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →