Inventor · disambiguated record
Sooin Park
Also filed as: PARK SOOIN
2 granted patents·1 pending application·0 citations·filing 2020–2024
27Inventor score
Files withDOOSAN CORP3
Top patents by PatentIndex Score
3 records- 0165US12278117B2Underfill film for semiconductor package and method for manufacturing semiconductor package using the sameDOOSAN CORP·Filed 2024·Granted Apr 15, 2025·0 cites·9 claims
- 0260US11942336B2Underfill film for semiconductor package and method for manufacturing semiconductor package using the sameDOOSAN CORP·Filed 2021·Granted Mar 26, 2024·0 cites·8 claims
- 0339US2023027838A1Underfill film for semiconductor package and method for manufacturing semiconductor package using sameDOOSAN CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →