Inventor · disambiguated record
Soo Hwan Son
Also filed as: SON SOO HWAN
65 granted patents·21 pending applications·99 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
86 records- 0198US10446323B1Electronic component having multilayer capacitor, interposer, and adhesive layerSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 15, 2019·16 cites·19 claims
- 0297US10347425B2Multilayer electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 9, 2019·12 cites·20 claims
- 0397US10249438B1Multilayer ceramic capacitor and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 2, 2019·12 cites·12 claims
- 0496US10056193B1Multilayer ceramic electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2017·Granted Aug 21, 2018·10 cites·14 claims
- 0591US10542626B2Multilayer electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 21, 2020·6 cites·22 claims
- 0690US11908627B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 20, 2024·1 cites·24 claims
- 0790US11289275B2Composite electronic componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 29, 2022·2 cites·16 claims
- 0888US9536647B2Multi-layered chip electronic componentSAMSUNG ELECTRO MECH·Filed 2012·Granted Jan 3, 2017·7 cites·13 claims
- 0983US11610740B2Multilayer ceramic electronic componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Mar 21, 2023·1 cites·26 claims
- 1083US11043333B2Composite electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 22, 2021·2 cites·18 claims
- 1183US9390862B2Composite electronic component and board with the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 12, 2016·5 cites·19 claims
- 1281US10937581B2Hybrid inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 1381US9877381B2Composite electronic component and board on which composite electronic component is mountedSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 23, 2018·2 cites·15 claims
- 1480US10321571B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 11, 2019·2 cites·20 claims
- 1580US8890647B2Magnetic layer composition, multilayer type coil component, and method for manufacturing the sameMOON BYEONG CHEOL·Filed 2012·Granted Nov 18, 2014·5 cites·7 claims
- 1679US12249466B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Granted Mar 11, 2025·0 cites·16 claims
- 1778US11206737B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Dec 21, 2021·1 cites·11 claims
- 1877US10553361B2Multilayer capacitor, method of manufacturing the same, and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 4, 2020·1 cites·12 claims
- 1975US10770237B2Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 8, 2020·1 cites·14 claims
- 2075US10403441B2Composite electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 3, 2019·2 cites·11 claims
- 2175US8597534B2Magnetic material composition for ceramic electronic component, method of manufacturing the same, and ceramic electronic component using the sameAN SUNG YONG·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 2271US8576040B2Multilayer type power inductorKIM MYEONG GI·Filed 2011·Granted Nov 5, 2013·2 cites·11 claims
- 2369US12406810B2Ceramic electronic component having external electrode which includes boron with high ratio of isotope 10BSAMSUNG ELECTRO MECH·Filed 2023·Granted Sep 2, 2025·0 cites·16 claims
- 2468US11733315B2Apparatus for detecting stacking direction of internal electrode of multilayer capacitor and detecting method thereofSAMSUNG ELECTRO MECH·Filed 2022·Granted Aug 22, 2023·0 cites·13 claims
- 2568US8729999B2Multi-layered chip electronic componentSAMSUNG ELECTRO MECH·Filed 2012·Granted May 20, 2014·1 cites·11 claims
- 2667US9894768B2Multilayer electronic component, manufacturing method thereof, and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 13, 2018·1 cites·16 claims
- 2767US9460837B2Gap composition of multi layered power inductor and multi layered power inductor including gap layer using the sameSON SOO HWAN·Filed 2012·Granted Oct 4, 2016·2 cites·5 claims
- 2866US9123460B2Ferrite composition for high frequency bead and chip bead comprising the sameAN SUNG YONG·Filed 2011·Granted Sep 1, 2015·1 cites·4 claims
- 2965US10707023B2Electronic componentsSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 7, 2020·0 cites·16 claims
- 3064US12014876B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 18, 2024·0 cites·16 claims
- 3164US11094461B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 17, 2021·0 cites·24 claims
- 3263US11166375B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 2, 2021·0 cites·12 claims
- 3363US9824791B2Multilayer electronic component and conductive paste composition for internal electrodeSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 21, 2017·0 cites·5 claims
- 3462US10622147B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 14, 2020·0 cites·23 claims
- 3562US2025218670A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 3661US11948745B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 2, 2024·0 cites·24 claims
- 3761US10460875B2Multilayer electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 29, 2019·0 cites·9 claims
- 3861US2019069410A1Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 3960US11087923B2Multi-layered ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 10, 2021·0 cites·21 claims
- 4060US10593484B2Electronic componentsSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 17, 2020·0 cites·18 claims
- 4160US9576697B2Multilayer electronic component and conductive paste composition for internal electrodeSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 21, 2017·0 cites·7 claims
- 4259US12033803B2Multilayer capacitorSAMSUNG ELECTRO MECH·Filed 2022·Granted Jul 9, 2024·0 cites·22 claims
- 4359US10714265B2Laminated electronic component and circuit board for mounting the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 14, 2020·0 cites·19 claims
- 4459US2025054700A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 4559US2025218683A1Multilayer electronic componentSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 4658US2024274365A1Multilayer ceramic capacitorSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 4758US2025166896A1Multilayer electronic component and board having multilayer electronic component mounted thereonSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 4857US10910163B2Multilayer electronic component and board having the same mounted thereonSAMSUNG ELECTRO MECH·Filed 2019·Granted Feb 2, 2021·0 cites·20 claims
- 4957US9530554B2Multilayer coil componentSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 27, 2016·0 cites·10 claims
- 5057US2016293315A1Hybrid inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →