Inventor · disambiguated record
Solji Song
Also filed as: SONG SOLJI
13 granted patents·8 pending applications·11 citations·filing 2020–2024
84Inventor score
Files withSAMSUNG ELECTRONICS CO LTD21
Top patents by PatentIndex Score
21 records- 0197US11676887B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·8 cites·20 claims
- 0289US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0381US11538783B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 0479US12354987B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0574US12218039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 0674US2025105181A1Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0773US11984420B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0873US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0971US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1067US12199056B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1163US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 1263US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1359US11854893B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1459US2025022764A1Semiconductor package comprising adhesion enhancer layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1557US12224256B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 1655US2024128239A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1755US2024162104A1Semiconductor device, semiconductor package, and semiconductor chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1855US2023420397A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1954US2024145366A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2053US12456627B2Dry etching apparatus and wafer etching system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2149US2023089399A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →