Inventor · disambiguated record
Sock Chien Tey
Also filed as: TEY SOCK CHIEN
3 granted patents·2 pending applications·1 citations·filing 2019–2025
48Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG5
Top patents by PatentIndex Score
5 records- 0164US2025266311A1Methods for Manufacturing Semiconductor PackagesINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0259US12300559B2Semiconductor packages and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 13, 2025·0 cites·15 claims
- 0357US11217511B2Quad package with conductive clips connected to terminals at upper surface of semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 4, 2022·1 cites·27 claims
- 0444US2023170329A1Semiconductor package with metal posts from structured leadframeINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 0542US10937744B2Semiconductor packages including roughening featuresINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 2, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →