Inventor · disambiguated record
Soichiro Umeda
Also filed as: UMEDA Soichiro
17 granted patents·12 pending applications·14 citations·filing 2015–2025
87Inventor score
Files withSHINDENGEN ELECTRIC MFG29
Top patents by PatentIndex Score
29 records- 0181US9966327B2Lead frame, semiconductor device, method for manufacturing lead frame, and method for manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2015·Granted May 8, 2018·4 cites·4 claims
- 0278US11776929B2Semiconductor device and lead frame memberSHINDENGEN ELECTRIC MFG·Filed 2020·Granted Oct 3, 2023·1 cites·13 claims
- 0368US11881444B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2019·Granted Jan 23, 2024·1 cites·6 claims
- 0466US10957630B2Semiconductor device and semiconductor device manufacturing methodSHINDENGEN ELECTRIC MFG·Filed 2018·Granted Mar 23, 2021·1 cites·10 claims
- 0566US10615092B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 7, 2020·1 cites·6 claims
- 0658US12494415B2Tip connection portion of terminal member and associated semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2022·Granted Dec 9, 2025·0 cites·4 claims
- 0753USD920937SPower module device containing semiconductor elementsSHINDENGEN ELECTRIC MFG·Filed 2019·Granted Jun 1, 2021·6 cites·1 claims
- 0851US2023009548A1Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2022·Application pending·0 cites
- 0951US2023011041A1Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2022·Application pending·0 cites
- 1051US2023011627A1Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2022·Application pending·0 cites
- 1148US2025259960A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1248US2025261348A1Electronic module and method of manufacturing electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1348US2025259935A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1448US2025259957A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1548US2025259918A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1648US2025259934A1Electronic module and method of manufacturing electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1748US2025324529A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1848US2025260185A1Electronic moduleSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 1948US2025259936A1Electronic module, method of manufacturing electronic module and electronic module manufacturing deviceSHINDENGEN ELECTRIC MFG·Filed 2025·Application pending·0 cites
- 2044US11557564B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2019·Granted Jan 17, 2023·0 cites·20 claims
- 2141US11404353B2Electronic device, connection body, and manufacturing method for electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Aug 2, 2022·0 cites·5 claims
- 2240US10910292B2Electronic device and connection bodySHINDENGEN ELECTRIC MFG·Filed 2017·Granted Feb 2, 2021·0 cites·6 claims
- 2339US10600712B2Electronic deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Mar 24, 2020·0 cites·6 claims
- 2438US11211311B2Electronic device and connection bodySHINDENGEN ELECTRIC MFG·Filed 2017·Granted Dec 28, 2021·0 cites·5 claims
- 2536US11075154B2Semiconductor device and method of manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jul 27, 2021·0 cites·14 claims
- 2636US11069538B2Semiconductor device and method of manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jul 20, 2021·0 cites·15 claims
- 2736US10896868B2Electronic device and connectorSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jan 19, 2021·0 cites·7 claims
- 2832US11309232B2Semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Apr 19, 2022·0 cites·4 claims
- 2930US11075091B2Method for manufacturing semiconductor deviceSHINDENGEN ELECTRIC MFG·Filed 2017·Granted Jul 27, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →