Inventor · disambiguated record
Son Jong Wang
Also filed as: WANG SON JONG
1 granted patent·2 pending applications·34 citations·filing 2000–2023
46Inventor score
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3 records- 0177US6552438B2Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Apr 22, 2003·34 cites·29 claims
- 0239US2024048106A1Radio frequency power amplifier moduleKOREA INST OF FUSION ENERGY·Filed 2023·Application pending·0 cites
- 0338US2024047845A1Stacked coaxial cavity radio frequency power combinerKOREA INST OF FUSION ENERGY·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →