Inventor · disambiguated record
Soon Wei Wang
Also filed as: WANG SOON WEI
36 granted patents·10 pending applications·40 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
46 records- 0194US10199311B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 5, 2019·9 cites·13 claims
- 0291US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0391US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0489US11404276B2Semiconductor packages with thin die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·2 cites·6 claims
- 0588US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0688US11721654B2Ultra-thin multichip power devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 8, 2023·2 cites·18 claims
- 0786US2025118635A1Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0885US12374554B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0985US11342189B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 24, 2022·1 cites·20 claims
- 1084US11532539B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 20, 2022·1 cites·8 claims
- 1182US8451621B2Semiconductor component and method of manufactureKRISHNAN SHUTESH·Filed 2010·Granted May 28, 2013·6 cites·24 claims
- 1281US9281258B1Chip scale packages and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Mar 8, 2016·6 cites·20 claims
- 1380US12243810B2Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1480US12176272B2Semiconductor package with wettable flankSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 1579US12040192B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1679US2025201675A1Semiconductor package with wettable flank and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1777US11908699B2Semiconductor packages with die including cavitiesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 1877US8449339B2Connector assembly and method of manufactureKRISHNAN SHUTESH·Filed 2010·Granted May 28, 2013·4 cites·19 claims
- 1977US2025149412A1Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 2076US12444609B2Silicon-on-insulator die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 14, 2025·0 cites·11 claims
- 2176US10756006B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND·Filed 2018·Granted Aug 25, 2020·1 cites·20 claims
- 2275US9748163B1Die support for enlarging die sizeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Aug 29, 2017·2 cites·19 claims
- 2374US10930604B2Ultra-thin multichip power devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 23, 2021·2 cites·19 claims
- 2472US11894234B2Semiconductor packages with die support structure for thin dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·0 cites·18 claims
- 2572US11404277B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·0 cites·7 claims
- 2671US12424522B2Leadless semiconductor packages, leadframes therefor, and methods of makingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 23, 2025·0 cites·13 claims
- 2771US11901184B2Backmetal removal methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2870US11508679B2Polymer resin and compression mold chip scale packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Nov 22, 2022·0 cites·15 claims
- 2969US11361970B2Silicon-on-insulator die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 14, 2022·0 cites·10 claims
- 3068US10971429B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 6, 2021·0 cites·16 claims
- 3166US7939380B2Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structureSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted May 10, 2011·3 cites·24 claims
- 3265US11348796B2Backmetal removal methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 3363US10825786B2Polymer resin and compression mold chip scale packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 3, 2020·0 cites·17 claims
- 3461US10825754B2Quad flat no leads package with locking featureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 3, 2020·1 cites·8 claims
- 3561US10607920B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 31, 2020·0 cites·8 claims
- 3661US10607921B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 31, 2020·0 cites·18 claims
- 3757US10283466B2Polymer resin and compression mold chip scale packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 7, 2019·0 cites·20 claims
- 3855US10916485B2Molded wafer level packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 9, 2021·0 cites·19 claims
- 3955US10177074B1Flexible semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 8, 2019·0 cites·6 claims
- 4054US2021043550A1Quad flat no leads package with locking featureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 4150US2025081647A1Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 4249US10559510B2Molded wafer level packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 11, 2020·0 cites·17 claims
- 4349US2024332135A1Semiconductor package having wettable flanks and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 4447US2020258750A1Die support structures and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2020·Application pending·0 cites
- 4544US10438877B1Multi-chip packages with stabilized die padsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 8, 2019·0 cites·20 claims
- 4634US2020035586A1Chip-on-lead semiconductor device packages with electrically isolated signal leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Soon Wei Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →