Inventor · disambiguated record
Srinivasa R. Aravamudhan
Also filed as: ARAVAMUDHAN SRINIVASA · ARAVAMUDHAN SRINIVASA R
6 granted patents·1 pending application·2 citations·filing 2014–2021
67Inventor score
Top patents by PatentIndex Score
7 records- 0162US9613933B2Package structure to enhance yield of TMI interconnectionsDE BONIS THOMAS J·Filed 2014·Granted Apr 4, 2017·2 cites·20 claims
- 0254US11569596B2Pressure features to alter the shape of a socketINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 0352US10049971B2Package structure to enhance yield of TMI interconnectionsINTEL CORP·Filed 2017·Granted Aug 14, 2018·0 cites·3 claims
- 0449US10573580B2Surface structure method and apparatus associated with compute or electronic component packagesINTEL CORP·Filed 2017·Granted Feb 25, 2020·0 cites·7 claims
- 0546US11830846B2Heated pins to couple with solder elementsINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·24 claims
- 0644US2024063134A1Integrated circuit supports with microstripsINTEL CORP·Filed 2021·Application pending·0 cites
- 0738US10505297B2Pin through solder interconnect and methodsINTEL CORP·Filed 2018·Granted Dec 10, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →