Inventor · disambiguated record
Sridhar Balakrishnan
Also filed as: BALAKRISHNAN SRIDHAR
22 granted patents·7 pending applications·304 citations·filing 1991–2024
95Inventor score
Top patents by PatentIndex Score
29 records- 0193US7276801B2Designs and methods for conductive bumpsINTEL CORP·Filed 2003·Granted Oct 2, 2007·56 cites·24 claims
- 0287US8508018B2Barrier layersAKOLKAR ROHAN N·Filed 2010·Granted Aug 13, 2013·14 cites·15 claims
- 0387US8461683B2Self-forming, self-aligned barriers for back-end interconnects and methods of making sameYOO HUI JAE·Filed 2011·Granted Jun 11, 2013·9 cites·17 claims
- 0487US7335587B2Post polish anneal of atomic layer deposition barrier layersINTEL CORP·Filed 2005·Granted Feb 26, 2008·13 cites·17 claims
- 0585US7772706B2Air-gap ILD with unlanded viasINTEL CORP·Filed 2007·Granted Aug 10, 2010·14 cites·17 claims
- 0682US2024203786A1Self-forming, self-aligned barriers for back-end interconnects and methods of making sameTAHOE RES LTD·Filed 2024·Application pending·0 cites
- 0781US7054562B1Method and system for suppressing ASE on a WDM networkCIENA CORP·Filed 2002·Granted May 30, 2006·25 cites·25 claims
- 0880US5164330AEtchback process for tungsten utilizing a NF3/AR chemistryINTEL CORP·Filed 1991·Granted Nov 17, 1992·109 cites·42 claims
- 0977US7629252B2Conformal electroless deposition of barrier layer materialsINTEL CORP·Filed 2005·Granted Dec 8, 2009·5 cites·13 claims
- 1075US2022059484A1Designs and methods for conductive bumpsINTEL CORP·Filed 2021·Application pending·0 cites
- 1173US9543261B2Designs and methods for conductive bumpsDUBIN VALERY M·Filed 2010·Granted Jan 10, 2017·2 cites·8 claims
- 1272US6559985B1Method and system for determining channel power in an optical communications networkCIENA CORP·Filed 2001·Granted May 6, 2003·10 cites·14 claims
- 1371US6614589B2Method and system for controlling amplifier power in an optical communications networkCIENA CORP·Filed 2001·Granted Sep 2, 2003·10 cites·12 claims
- 1468US8580679B2Designs and methods for conductive bumpsDUBIN VALERY M·Filed 2007·Granted Nov 12, 2013·2 cites·19 claims
- 1563US11201129B2Designs and methods for conductive bumpsINTEL CORP·Filed 2019·Granted Dec 14, 2021·0 cites·8 claims
- 1658US10249588B2Designs and methods for conductive bumpsINTEL CORP·Filed 2016·Granted Apr 2, 2019·0 cites·20 claims
- 1756US6312830B1Method and an apparatus for forming an under bump metallization structureINTEL CORP·Filed 1999·Granted Nov 6, 2001·17 cites·6 claims
- 1855US2016307796A1Self-forming, self-aligned barriers for back-end interconnects and methods of making sameINTEL CORP·Filed 2016·Application pending·0 cites
- 1954US9269686B2Debond interconnect structuresINTEL CORP·Filed 2013·Granted Feb 23, 2016·0 cites·9 claims
- 2053US6600596B2Method and system for controlling amplifier power in an optical communications network having add/drop capabilityCIENA CORP·Filed 2001·Granted Jul 29, 2003·2 cites·20 claims
- 2152US9461010B2Debond interconnect structuresINTEL CORP·Filed 2016·Granted Oct 4, 2016·0 cites·19 claims
- 2252US6461954B1Method and an apparatus for forming an under bump metallization structureINTEL CORP·Filed 2001·Granted Oct 8, 2002·4 cites·9 claims
- 2350US7081986B2Method and system for controlling amplifier power in an optical communications network having add/drop capabilityCIENA CORP·Filed 2003·Granted Jul 25, 2006·1 cites·14 claims
- 2447US8637778B2Debond interconnect structuresMA QING·Filed 2010·Granted Jan 28, 2014·0 cites·10 claims
- 2547US2013260553A1Self-forming, self-aligned barriers for back-end interconnects and methods of making sameYOO HUI JAE·Filed 2013·Application pending·0 cites
- 2644US2009169760A1Copper metallization utilizing reflow on noble metal linersAKOLKAR ROHAN·Filed 2007·Application pending·0 cites
- 2742US6054376AMethod of sealing a semiconductor substrateINTEL CORP·Filed 1997·Granted Apr 25, 2000·11 cites·30 claims
- 2839US2009321935A1Methods of forming improved electromigration resistant copper films and structures formed therebyO'BRIEN KEVIN·Filed 2008·Application pending·0 cites
- 2936US2010200991A1Dopant Enhanced InterconnectAKOLKAR ROHAN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →