Inventor · disambiguated record
Sri Sai Sivakumar Vegunta
Also filed as: VEGUNTA SRI SAI SIVAKUMAR
11 granted patents·1 pending application·62 citations·filing 2015–2022
88Inventor score
Top patents by PatentIndex Score
12 records- 0195US11088017B2Stair step structures including insulative materials, and related devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 10, 2021·4 cites·17 claims
- 0295US10269625B1Methods of forming semiconductor structures having stair step structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 23, 2019·39 cites·7 claims
- 0389US11355508B2Devices including floating vias and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 7, 2022·2 cites·25 claims
- 0489US10600682B2Semiconductor devices including a stair step structure, and related methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·6 cites·20 claims
- 0586US10096612B2Three dimensional memory device having isolated periphery contacts through an active layer exhume processINTEL CORP·Filed 2015·Granted Oct 9, 2018·4 cites·20 claims
- 0684US10318170B2Solid state memory componentINTEL CORP·Filed 2018·Granted Jun 11, 2019·3 cites·25 claims
- 0782US11735473B2Methods for forming memory devices, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 22, 2023·1 cites·20 claims
- 0882US9857989B1Solid state memory componentINTEL CORP·Filed 2016·Granted Jan 2, 2018·3 cites·16 claims
- 0971US11770928B2Devices including floating viasMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 1060US11201083B2Methods for forming memory devices, and associated devices and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 14, 2021·0 cites·11 claims
- 1160US11010058B2Solid state memory componentINTEL CORP·Filed 2019·Granted May 18, 2021·0 cites·29 claims
- 1253US2019051662A1Three dimensional memory device having isolated periphery contacts through an active layer exhume processINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →