Inventor · disambiguated record
Stanley Craig Beddingfield
Also filed as: BEDDINGFIELD STANLEY C · BEDDINGFIELD STANLEY CRAIG
10 granted patents·6 pending applications·895 citations·filing 1995–2018
92Inventor score
Files withTEXAS INSTRUMENTS INC9MOTOROLA INC4BEDDINGFIELD STANLEY CRAIG1LYNE KEVIN P1MCCARTHY ROBERT FABIAN1
Top patents by PatentIndex Score
16 records- 0196US5710071AProcess for underfilling a flip-chip semiconductor deviceMOTOROLA INC·Filed 1995·Granted Jan 20, 1998·396 cites·17 claims
- 0294US6372622B1Fine pitch bumping with improved device standoff and bump volumeMOTOROLA INC·Filed 1999·Granted Apr 16, 2002·180 cites·23 claims
- 0392US5726502ABumped semiconductor device with alignment features and method for making the sameMOTOROLA INC·Filed 1996·Granted Mar 10, 1998·158 cites·13 claims
- 0491US8049119B2Integrated circuit package having integrated faraday shieldTEXAS INSTRUMENTS INC·Filed 2010·Granted Nov 1, 2011·20 cites·11 claims
- 0589US5977632AFlip chip bump structure and method of makingMOTOROLA INC·Filed 1998·Granted Nov 2, 1999·111 cites·22 claims
- 0684US8304867B2Crack arrest vias for IC devicesMCCARTHY ROBERT FABIAN·Filed 2010·Granted Nov 6, 2012·12 cites·9 claims
- 0784US7741567B2Integrated circuit package having integrated faraday shieldTEXAS INSTRUMENTS INC·Filed 2008·Granted Jun 22, 2010·15 cites·20 claims
- 0880US9666553B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·3 cites·20 claims
- 0957US10262957B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 16, 2019·0 cites·19 claims
- 1054US9941228B2Millimeter wave integrated circuit with ball grid array package including transmit and receive channelsTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 10, 2018·0 cites·19 claims
- 1147US2009140401A1System and Method for Improving Reliability of Integrated Circuit PackagesBEDDINGFIELD STANLEY CRAIG·Filed 2007·Application pending·0 cites
- 1245US2009278263A1Reliability wcsp layoutsTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 1345US2011204511A1System and Method for Improving Reliability of Integrated Circuit PackagesTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 1440US2007023910A1Dual BGA alloy structure for improved board-level reliability performanceTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 1539US2007029661A1Power plane design and jumper wire bond for voltage drop minimizationTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 1634US2011193200A1Semiconductor wafer chip scale package test flow and dicing processLYNE KEVIN P·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →