Inventor · disambiguated record
Stefan Behler
Also filed as: BEHLER STEFAN
6 granted patents·2 pending applications·38 citations·filing 2000–2024
79Inventor score
Top patents by PatentIndex Score
8 records- 0177US8133823B2Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrateBEHLER STEFAN·Filed 2008·Granted Mar 13, 2012·9 cites·17 claims
- 0273US8715457B2Method for detaching and removing a semiconductor chip from a foilBEHLER STEFAN·Filed 2009·Granted May 6, 2014·6 cites·4 claims
- 0366US2024363386A1Die EjectorBESI SWITZERLAND AG·Filed 2024·Application pending·0 cites
- 0464US7066373B2Method for aligning the bondhead of a Die BonderUNAXIS INT TRADING LTD·Filed 2004·Granted Jun 27, 2006·12 cites·2 claims
- 0554US6435492B1Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrateESEC TRADING SA·Filed 2000·Granted Aug 20, 2002·10 cites·4 claims
- 0649US12062566B2Die ejectorBESI SWITZERLAND AG·Filed 2019·Granted Aug 13, 2024·0 cites·16 claims
- 0736US6585145B2Die bonder and/or wire bonder with a device for holding down a substrateESEC TRADING SA·Filed 2001·Granted Jul 1, 2003·1 cites·4 claims
- 0831US2010315655A1Method And Device For Measuring A Height DifferenceESEC AG·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →