Inventor · disambiguated record
Steffen Bieselt
Also filed as: BIESELT STEFFEN
36 granted patents·4 pending applications·68 citations·filing 2012–2025
96Inventor score
Files withINFINEON TECHNOLOGIES DRESDEN GMBH24INFINEON TECH DRESDEN GMBH & CO KG10INFINEON TECHNOLOGIES AG6
Top patents by PatentIndex Score
40 records- 0195US9382111B2Micromechanical system and method for manufacturing a micromechanical systemINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 5, 2016·13 cites·15 claims
- 0294US9938133B2System and method for a comb-drive MEMS deviceINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Apr 10, 2018·10 cites·29 claims
- 0388US10852319B2Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor elementINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Dec 1, 2020·4 cites·21 claims
- 0488US9330929B1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted May 3, 2016·8 cites·12 claims
- 0587US9263357B2Carrier with hollow chamber and support structure thereinINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Feb 16, 2016·6 cites·14 claims
- 0683US11422151B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 23, 2022·1 cites·21 claims
- 0783US9929181B2Method for manufacturing an electronic device and method for operating an electronic deviceINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Mar 27, 2018·3 cites·5 claims
- 0882US10961116B2Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensorINFINEON TECH DRESDEN GMBH & CO KG·Filed 2019·Granted Mar 30, 2021·2 cites·20 claims
- 0981US12477823B2Semiconductor component including an electronic component based on polycrystalline siliconINFINEON TECH DRESDEN GMBH & CO KG·Filed 2024·Granted Nov 18, 2025·0 cites·18 claims
- 1080US10170497B2Method for manufacturing an electronic device and method for operating an electronic deviceINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jan 1, 2019·2 cites·12 claims
- 1179US2025305900A1Semiconductor die with pressure and acceleration sensor elementsINFINEON TECH DRESDEN GMBH & CO KG·Filed 2025·Application pending·0 cites
- 1278US10683203B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jun 16, 2020·1 cites·18 claims
- 1378US9711393B2Silicon on nothing devices and methods of formation thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 18, 2017·2 cites·22 claims
- 1477US9136328B2Silicon on nothing devices and methods of formation thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2012·Granted Sep 15, 2015·3 cites·36 claims
- 1576US12332271B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 17, 2025·0 cites·13 claims
- 1676US10539587B2Accelerometer with compatibility to complementary metal-oxide-semiconductor technologiesINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Jan 21, 2020·1 cites·20 claims
- 1775US10870575B2Stressed decoupled micro-electro-mechanical system sensorINFINEON TECH DRESDEN GMBH & CO KG·Filed 2018·Granted Dec 22, 2020·2 cites·20 claims
- 1875US9663354B2Mechanical stress-decoupling in semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 30, 2017·3 cites·5 claims
- 1973US9560765B2Electronic device, a method for manufacturing an electronic device, and a method for operating an electronic deviceINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Jan 31, 2017·2 cites·20 claims
- 2071US12359994B2Semiconductor die with pressure and acceleration sensor elementsINFINEON TECH DRESDEN GMBH & CO KG·Filed 2021·Granted Jul 15, 2025·0 cites·22 claims
- 2171US12002812B2Method of producing a semiconductor component and semiconductor componentINFINEON TECH DRESDEN GMBH & CO KG·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 2270US10684306B2Capacitive microelectromechanical device and method for forming a capacitive microelectromechanical deviceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 16, 2020·1 cites·20 claims
- 2370US9716015B2Carrier and a method for processing a carrierINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2015·Granted Jul 25, 2017·1 cites·19 claims
- 2470US9236241B2Wafer, a method for processing a wafer, and a method for processing a carrierINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2014·Granted Jan 12, 2016·2 cites·20 claims
- 2569US9887355B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 6, 2018·1 cites·22 claims
- 2669US2024343555A1Sensor system with a microelectromechanical sensor element and method for producing a sensor systemINFINEON TECH DRESDEN GMBH & CO KG·Filed 2024·Application pending·0 cites
- 2766US12043539B2Sensor system with a microelectromechanical sensor element and method for producing a sensor systemINFINEON TECH DRESDEN GMBH & CO KG·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 2863US11493532B2Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor elementINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Nov 8, 2022·0 cites·2 claims
- 2963US11078072B2Microelectromechanical device, method for manufacturing a microelectromechanical device, and method for manufacturing a system on chip using a CMOS processINFINEON TECH DRESDEN GMBH & CO KG·Filed 2020·Granted Aug 3, 2021·0 cites·18 claims
- 3060US10544037B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted Jan 28, 2020·0 cites·19 claims
- 3160US10290805B2Emitter and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2018·Granted May 14, 2019·0 cites·20 claims
- 3257US9896329B2Integrated semiconductor device and manufacturing methodINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Feb 20, 2018·0 cites·19 claims
- 3356US10354911B2Silicon on nothing devices and methods of formation thereofINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Jul 16, 2019·0 cites·14 claims
- 3454US9613878B2Carrier and a method for processing a carrierINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2013·Granted Apr 4, 2017·0 cites·8 claims
- 3553US10096511B2Carrier and a method for processing a carrierINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Oct 9, 2018·0 cites·9 claims
- 3652US9991340B2Mechanical stress-decoupling in semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 5, 2018·0 cites·8 claims
- 3752US9938135B2Stress decoupled piezoresistive relative pressure sensor and method for manufacturing the sameINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Apr 10, 2018·0 cites·25 claims
- 3851US2025380437A1Method for manufacturing a vertical rf bipolar transistor, vertical rf bipolar transistor, and semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 3947US2016185594A1Systems and methods for horizontal integration of acceleration sensor structuresINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Application pending·0 cites
- 4045US10580663B2Microelectromechanical device and method for forming a microelectromechanical device having a support structure holding a lamella structureINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Mar 3, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →