Inventor · disambiguated record
Stephan Blaszczak
Also filed as: BLASZCZAK STEPHAN
6 granted patents·8 pending applications·42 citations·filing 2003–2017
78Inventor score
Top patents by PatentIndex Score
14 records- 0178US6873060B2Electronic component with a semiconductor chip, method of producing an electronic component and a panel with a plurality of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 29, 2005·24 cites·17 claims
- 0268US7223639B2Method of producing an electronic component and a panel with a plurality of electronic componentsINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 29, 2007·14 cites·12 claims
- 0346US11111385B2Silicone compositionOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted Sep 7, 2021·0 cites·10 claims
- 0442US7229857B2Method for producing a protection for chip edges and system for the protection of chip edgesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 12, 2007·2 cites·13 claims
- 0541US7384822B2Package for semiconductor components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 10, 2008·2 cites·20 claims
- 0636US7034383B2Electronic component and panel and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 25, 2006·0 cites·14 claims
- 0735US2006270109A1Manufacturing method for an electronic component assembly and corresponding electronic component assemblyBLASZCZAK STEPHAN·Filed 2005·Application pending·0 cites
- 0834US2005104227A1Substrate-based package for integrated circuitsFiled 2004·Application pending·0 cites
- 0934US2005098890A1Method for producing an adhesive bond and adhesive bond between a chip and a planar surfaceFiled 2004·Application pending·0 cites
- 1034US2004159928A1Supporting structure for a chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 1133US2018143414A1Method of producing a lens for an optoelectronic lighting deviceOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2016·Application pending·0 cites
- 1233US2005121807A1Arrangement of a chip package constructed on a substrate and substrate for production of the sameFiled 2004·Application pending·0 cites
- 1332US2007221318A1Adhesion tape and method for mounting a chip onto a substrateREISS MARTIN·Filed 2006·Application pending·0 cites
- 1432US2007224729A1Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assemblyREISS MARTIN·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Stephan Blaszczak files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →