Inventor · disambiguated record
Stephen L. Buchwalter
Also filed as: BUCHWALTER STEPHEN · BUCHWALTER STEPHEN L · BUCHWALTER STEPHEN LESLIE
80 granted patents·6 pending applications·1,340 citations·filing 1976–2020
99Inventor score
Top patents by PatentIndex Score
86 records- 0194US7399421B2Injection molded microopticsIBM·Filed 2005·Granted Jul 15, 2008·25 cites·20 claims
- 0293US8162200B2Micro-fluidic injection molded solder (IMS)BUCHWALTER STEPHEN L·Filed 2011·Granted Apr 24, 2012·12 cites·8 claims
- 0392US7838954B2Semiconductor structure with solder bumpsIBM·Filed 2008·Granted Nov 23, 2010·24 cites·16 claims
- 0492US5281447APatterned deposition of metals via photochemical decomposition of metal-oxalate complexesIBM·Filed 1991·Granted Jan 25, 1994·85 cites·12 claims
- 0591US7786001B2Electrical interconnect structure and methodIBM·Filed 2007·Granted Aug 31, 2010·16 cites·9 claims
- 0691US6698077B2Display fabrication using modular active devicesIBM·Filed 2000·Granted Mar 2, 2004·39 cites·22 claims
- 0790US9490408B2Injection molded microopticsIBM·Filed 2013·Granted Nov 8, 2016·4 cites·11 claims
- 0890US7980446B2Micro-fluidic injection molded solder (IMS)INTERNAT BUSINSS MACHINES CORP·Filed 2009·Granted Jul 19, 2011·10 cites·20 claims
- 0990US5932682ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1995·Granted Aug 3, 1999·55 cites·5 claims
- 1088US6924171B2Bilayer wafer-level underfillIBM·Filed 2001·Granted Aug 2, 2005·51 cites·22 claims
- 1187US7928585B2Sprocket opening alignment process and apparatus for multilayer solder decalIBM·Filed 2007·Granted Apr 19, 2011·13 cites·17 claims
- 1287US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 1387US6111323AReworkable thermoplastic encapsulantIBM·Filed 1997·Granted Aug 29, 2000·76 cites·10 claims
- 1486US5512613ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1994·Granted Apr 30, 1996·77 cites·11 claims
- 1585US7404251B2Manufacture of printed circuit boards with stubless plated through-holesIBM·Filed 2006·Granted Jul 29, 2008·9 cites·10 claims
- 1685US6879098B2Display fabrication using modular active devicesIBM·Filed 2004·Granted Apr 12, 2005·24 cites·8 claims
- 1785US5659203AReworkable polymer chip encapsulantIBM·Filed 1995·Granted Aug 19, 1997·71 cites·16 claims
- 1884US8963020B2Process for making stubless printed circuit boardsIBM·Filed 2013·Granted Feb 24, 2015·4 cites·15 claims
- 1984US5357005AReactive surface functionalizationIBM·Filed 1991·Granted Oct 18, 1994·51 cites·35 claims
- 2083US7516879B1Method of producing coaxial solder bump connections using injection molding of solderIBM·Filed 2008·Granted Apr 14, 2009·10 cites·1 claims
- 2183US5133840ASurface midification of a polyimideIBM·Filed 1990·Granted Jul 28, 1992·40 cites·33 claims
- 2282US4198331AResinous coating compositions curable by Michael adduct exchangePPG INDUSTRIES INC·Filed 1978·Granted Apr 15, 1980·28 cites·13 claims
- 2381US10490594B2Injection molded microopticsIBM·Filed 2016·Granted Nov 26, 2019·2 cites·10 claims
- 2479US5560934ACleavable diepoxide for removable epoxy compositionsIBM·Filed 1995·Granted Oct 1, 1996·51 cites·29 claims
- 2578US7776993B2Underfilling with acid-cleavable acetal and ketal epoxy oligomersIBM·Filed 2005·Granted Aug 17, 2010·8 cites·13 claims
- 2678US4248753AMichael adducts of polymeric materials useful in coating applicationsPPG INDUSTRIES INC·Filed 1978·Granted Feb 3, 1981·25 cites·29 claims
- 2777US8376207B2Micro-fluidic injection molded solder (IMS)IBM·Filed 2012·Granted Feb 19, 2013·2 cites·21 claims
- 2877US7936060B2Reworkable electronic device assembly and methodIBM·Filed 2009·Granted May 3, 2011·7 cites·12 claims
- 2977US6919420B2Acid-cleavable acetal and ketal based epoxy oligomersIBM·Filed 2002·Granted Jul 19, 2005·21 cites·23 claims
- 3077US6617698B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2001·Granted Sep 9, 2003·11 cites·8 claims
- 3177US5786986AMulti-level circuit card structureIBM·Filed 1994·Granted Jul 28, 1998·61 cites·24 claims
- 3275US10833120B2Injection molded microopticsIBM·Filed 2019·Granted Nov 10, 2020·0 cites·10 claims
- 3375US8541299B2Electrical interconnect forming methodBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Sep 24, 2013·3 cites·19 claims
- 3475US5242713AMethod for conditioning an organic polymeric materialIBM·Filed 1988·Granted Sep 7, 1993·28 cites·35 claims
- 3573US5930597AReworkable polymer chip encapsulantIBM·Filed 1997·Granted Jul 27, 1999·38 cites·6 claims
- 3670US8476773B2Electrical interconnect structureBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Jul 2, 2013·2 cites·20 claims
- 3769US6632536B2Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displaysIBM·Filed 2000·Granted Oct 14, 2003·9 cites·13 claims
- 3869US5187241AIsoimide modifications of a polyimide and reaction thereof with nucleophilesIBM·Filed 1991·Granted Feb 16, 1993·23 cites·61 claims
- 3968US4102863ACationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymersPPG INDUSTRIES INC·Filed 1976·Granted Jul 25, 1978·14 cites·4 claims
- 4067US8227264B2Reworkable electronic device assembly and methodANDRY PAUL S·Filed 2011·Granted Jul 24, 2012·2 cites·8 claims
- 4166US5203955AMethod for etching an organic polymeric materialIBM·Filed 1991·Granted Apr 20, 1993·28 cites·18 claims
- 4265US11541472B2Ultrasonic-assisted solder transferIBM·Filed 2020·Granted Jan 3, 2023·0 cites·12 claims
- 4365US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 4465US7523852B2Solder interconnect structure and method using injection molded solderIBM·Filed 2004·Granted Apr 28, 2009·11 cites·13 claims
- 4564US8242010B2Electrical interconnect forming methodBUCHWALTER STEPHEN LESLIE·Filed 2010·Granted Aug 14, 2012·1 cites·20 claims
- 4663US8404981B2Process for making stubless printed circuit boardsBUCHWALTER STEPHEN L·Filed 2008·Granted Mar 26, 2013·2 cites·10 claims
- 4763US7815968B2Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formationIBM·Filed 2008·Granted Oct 19, 2010·2 cites·46 claims
- 4861US5340451AProcess for producing a metal organic polymer combinationIBM·Filed 1993·Granted Aug 23, 1994·22 cites·35 claims
- 4959US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 5058US6104466APrecision alignment of platesIBM·Filed 1999·Granted Aug 15, 2000·20 cites·8 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →