Inventor · disambiguated record
Stuart Cardwell
Also filed as: CARDWELL STUART
5 granted patents·7 citations·filing 2010–2021
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0174US8525334B2Semiconductor on semiconductor substrate multi-chip-scale packageCARDWELL STUART·Filed 2010·Granted Sep 3, 2013·7 cites·13 claims
- 0253US11848257B2Bending semiconductor chip for connection at different vertical levelsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Dec 19, 2023·0 cites·18 claims
- 0345US8865587B2Multi-chip-scale packageINT RECTIFIER CORP·Filed 2013·Granted Oct 21, 2014·0 cites·18 claims
- 0444US10319620B2Common procedure of interconnecting electronic chip with connector body and forming the connector bodyINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 11, 2019·0 cites·22 claims
- 0542US11393743B2Semiconductor assembly with conductive frame for I/O standoff and thermal dissipationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →