Inventor · disambiguated record
Sterling Chaffins
Also filed as: CHAFFINS STERLING
43 granted patents·18 pending applications·73 citations·filing 2005–2024
96Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO46CHAFFINS STERLING4HEWLETT PACKARD DEVELOPMENT CO LP2PERIDOT PRINT LLC2BURKUM PHILIP1
Top patents by PatentIndex Score
61 records- 0194US10926464B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Feb 23, 2021·7 cites·13 claims
- 0294US10375765B23-dimensional printed load cell partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 6, 2019·15 cites·20 claims
- 0392US11760010B2Forming three-dimensional (3D) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Sep 19, 2023·1 cites·12 claims
- 0492US11199456B2Temperature sensorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Dec 14, 2021·5 cites·15 claims
- 0590US11911825B2Fusing electronic components into three-dimensional objects via additive manufacturing processesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Feb 27, 2024·3 cites·5 claims
- 0690US10047233B2Magenta inksHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Aug 14, 2018·4 cites·13 claims
- 0789US12214549B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Granted Feb 4, 2025·0 cites·16 claims
- 0887US11090862B2Strain sensorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 17, 2021·4 cites·16 claims
- 0987US11001000B2Three-dimensional (3D) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted May 11, 2021·3 cites·12 claims
- 1083US11712845B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 1, 2023·1 cites·13 claims
- 1183US11001050B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted May 11, 2021·3 cites·11 claims
- 1283US7569331B2Conductive patterningHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Aug 4, 2009·13 cites·22 claims
- 1383US2023303884A1Pretreat compositionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 1482US10040959B2Pigment-based inkjet inksHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted Aug 7, 2018·2 cites·13 claims
- 1582US2023373157A1Forming three-dimensional (3d) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2023·Application pending·0 cites
- 1681US12358243B2Printing conductive elementsPERIDOT PRINT LLC·Filed 2024·Granted Jul 15, 2025·0 cites·6 claims
- 1781US7498117B2System and method for radiation imaging by in-situ particle formationHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Mar 3, 2009·4 cites·30 claims
- 1879US11642842B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 9, 2023·1 cites·15 claims
- 1978US12042986B23-dimensional printed partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jul 23, 2024·0 cites·9 claims
- 2078US11981075B23-dimensional printed partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted May 14, 2024·0 cites·11 claims
- 2178US11064572B23-dimensional printed heaterHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jul 13, 2021·2 cites·11 claims
- 2278US2025058519A1Three-dimensional printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2024·Application pending·0 cites
- 2375US10294381B2Pigment-based inkjet inksHEWLETT PACKARD DEVELOPMENT CO·Filed 2014·Granted May 21, 2019·1 cites·15 claims
- 2473US10294382B2Magenta inksHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 21, 2019·0 cites·20 claims
- 2572US12447674B2Three-dimensional printing with binder agentPERIDOT PRINT LLC·Filed 2021·Granted Oct 21, 2025·0 cites·15 claims
- 2671US12011874B2Strain sensorsHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Jun 18, 2024·0 cites·10 claims
- 2768US9815282B2Fluid ejection structureHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Nov 14, 2017·1 cites·16 claims
- 2868US2021229358A1Three-dimensional (3d) printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 2967US9068096B2Perfluoropolyethers as ink additivesCHAFFINS STERLING·Filed 2011·Granted Jun 30, 2015·1 cites·15 claims
- 3066US12138860B2Three-dimensional printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 12, 2024·0 cites·15 claims
- 3166US10654268B2Modifying firing parameters for printheadsHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted May 19, 2020·0 cites·19 claims
- 3263US11458675B2Material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Oct 4, 2022·0 cites·13 claims
- 3363US7733016B2Defining electrode regions of electroluminescent panelHEWLETT PACKARD DEVELOPMENT CO·Filed 2005·Granted Jun 8, 2010·2 cites·20 claims
- 3462US2019134898A1Forming three-dimensional (3d) electronic partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 3561US11312877B2Pretreat compositionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Apr 26, 2022·0 cites·16 claims
- 3660US11465341B23-dimensional printed partsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Oct 11, 2022·0 cites·12 claims
- 3759US11167482B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Nov 9, 2021·0 cites·20 claims
- 3859US2021170678A1Printing conductive elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Application pending·0 cites
- 3958US11426932B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Aug 30, 2022·0 cites·12 claims
- 4056US11427725B2Photoluminescent material setsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 30, 2022·0 cites·15 claims
- 4155US10183488B2Printer fluid impedance sensing in a printheadHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jan 22, 2019·0 cites·20 claims
- 4255US2011033660A1Adhesive Tape for use with a Polymer SubstrateFENG YI·Filed 2008·Application pending·0 cites
- 4355US2019010348A1Pretreat compositionsHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Application pending·0 cites
- 4454US2009023011A1Systems and Methods for Forming Conductive Traces on Plastic SubstratesHEWLETT PACKARD DEVELOPMENT CO·Filed 2007·Application pending·0 cites
- 4553US11292189B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 5, 2022·0 cites·15 claims
- 4652US11738508B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Aug 29, 2023·0 cites·15 claims
- 4751US11795338B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Oct 24, 2023·0 cites·12 claims
- 4851US9707766B2Fluid directing assemblyHEWLETT PACKARD DEVELOPMENT CO LP·Filed 2014·Granted Jul 18, 2017·0 cites·15 claims
- 4950US11304313B2Three-dimensional printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Apr 12, 2022·0 cites·15 claims
- 5048US11733020B2First object for assembly with a second object and method of assembly thereofUNIV NANYANG TECH·Filed 2020·Granted Aug 22, 2023·0 cites·18 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →