Inventor · disambiguated record
Steve S. Chiang
Also filed as: CHIANG STEVE · CHIANG STEVE S · CHIANG STEVE S S · EL-AYAT KHALED A
46 granted patents·2 pending applications·2,859 citations·filing 1988–2007
99Inventor score
Top patents by PatentIndex Score
48 records- 0198US7198982B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 3, 2007·52 cites·26 claims
- 0298US5510730AReconfigurable programmable interconnect architectureACTEL CORP·Filed 1995·Granted Apr 23, 1996·168 cites·14 claims
- 0398US5485031AAntifuse structure suitable for VLSI applicationACTEL CORP·Filed 1993·Granted Jan 16, 1996·330 cites·4 claims
- 0496US6034427ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1998·Granted Mar 7, 2000·294 cites·41 claims
- 0596US5015885AReconfigurable programmable interconnect architectureACTEL CORP·Filed 1989·Granted May 14, 1991·80 cites·39 claims
- 0695US6995040B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesREFLECTIVITY INC·Filed 2005·Granted Feb 7, 2006·21 cites·74 claims
- 0794US5906042AMethod and structure to interconnect traces of two conductive layers in a printed circuit boardPROLINX LABS CORP·Filed 1995·Granted May 25, 1999·203 cites·30 claims
- 0892US5872338AMultilayer board having insulating isolation ringsPROLINX LABS CORP·Filed 1996·Granted Feb 16, 1999·125 cites·20 claims
- 0992US5187393AReconfigurable programmable interconnect architectureACTEL CORP·Filed 1992·Granted Feb 16, 1993·93 cites·6 claims
- 1090US5962815AAntifuse interconnect between two conducting layers of a printed circuit boardPROLINX LABS CORP·Filed 1995·Granted Oct 5, 1999·70 cites·11 claims
- 1190US4941028AStructure for protecting thin dielectrics during processingACTEL CORP·Filed 1988·Granted Jul 10, 1990·96 cites·5 claims
- 1289US5412244AElectrically-programmable low-impedance anti-fuse elementACTEL CORP·Filed 1993·Granted May 2, 1995·94 cites·18 claims
- 1386US7573111B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Aug 11, 2009·7 cites·38 claims
- 1485US5808351AProgrammable/reprogramable structure using fuses and antifusesPROLINX LABS CORP·Filed 1994·Granted Sep 15, 1998·86 cites·72 claims
- 1585US5572409AApparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit boardPROLINX LABS CORP·Filed 1994·Granted Nov 5, 1996·85 cites·15 claims
- 1684US5834824AUse of conductive particles in a nonconductive body as an integrated circuit antifusePROLINX LABS CORP·Filed 1995·Granted Nov 10, 1998·81 cites·10 claims
- 1784US5767575ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1995·Granted Jun 16, 1998·82 cites·38 claims
- 1884US5537108AMethod and structure for programming fusesPROLINX LABS CORP·Filed 1994·Granted Jul 16, 1996·76 cites·24 claims
- 1984US5266829AElectrically-programmable low-impedance anti-fuse elementACTEL CORP·Filed 1992·Granted Nov 30, 1993·73 cites·5 claims
- 2083US7307775B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 11, 2007·35 cites·161 claims
- 2183US5126282AMethods of reducing anti-fuse resistance during programmingACTEL CORP·Filed 1990·Granted Jun 30, 1992·81 cites·5 claims
- 2282US5917229AProgrammable/reprogrammable printed circuit board using fuse and/or antifuse as interconnectPROLINX LABS CORP·Filed 1996·Granted Jun 29, 1999·71 cites·32 claims
- 2381US5449947ARead-disturb tolerant metal-to-metal antifuse and fabrication methodACTEL CORP·Filed 1993·Granted Sep 12, 1995·70 cites·5 claims
- 2481US5367208AReconfigurable programmable interconnect architectureACTEL CORP·Filed 1993·Granted Nov 22, 1994·32 cites·43 claims
- 2580US5987744AMethod for supporting one or more electronic componentsPROLINX LABS CORP·Filed 1997·Granted Nov 23, 1999·54 cites·8 claims
- 2679US7449358B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Nov 11, 2008·4 cites·78 claims
- 2779US7286278B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 23, 2007·4 cites·53 claims
- 2879US5130777AApparatus for improving antifuse programming yield and reducing antifuse programming timeACTEL CORP·Filed 1991·Granted Jul 14, 1992·63 cites·5 claims
- 2978US6111302AAntifuse structure suitable for VLSI applicationACTEL CORP·Filed 1995·Granted Aug 29, 2000·44 cites·2 claims
- 3072US7671428B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Mar 2, 2010·2 cites·55 claims
- 3171US7655492B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 2, 2010·2 cites·40 claims
- 3269US5381035AMetal-to-metal antifuse including etch stop layerFiled 1993·Granted Jan 10, 1995·35 cites·20 claims
- 3367US7586668B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 8, 2009·1 cites·42 claims
- 3466US5813881AProgrammable cable and cable adapter using fuses and antifusesPROLINX LABS CORP·Filed 1994·Granted Sep 29, 1998·36 cites·29 claims
- 3564US5087958AMisalignment tolerant antifuseACTEL CORP·Filed 1990·Granted Feb 11, 1992·34 cites·19 claims
- 3663US5369054ACircuits for ESD protection of metal-to-metal antifuses during processingACTEL CORP·Filed 1993·Granted Nov 29, 1994·25 cites·4 claims
- 3762US6995034B2Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substratesREFLECTIVITY INC·Filed 2004·Granted Feb 7, 2006·10 cites·56 claims
- 3862US6603187B1Antifuse structure suitable for VLSI applicationACTEL CORP·Filed 2000·Granted Aug 5, 2003·8 cites·40 claims
- 3962US5316971AMethods for programming antifuses having at least one metal electrodeACTEL CORP·Filed 1992·Granted May 31, 1994·33 cites·8 claims
- 4054US5525830AMetal-to-metal antifuse including etch stop layerACTEL CORP·Filed 1994·Granted Jun 11, 1996·18 cites·10 claims
- 4152US5726482ADevice-under-test card for a burn-in boardPROLINX LABS CORP·Filed 1994·Granted Mar 10, 1998·20 cites·2 claims
- 4251US2005139940A1Methods for depositing, releasing and packaging microelectromechanical devices on wafer substratesFiled 2005·Application pending·0 cites
- 4350US5111262AStructure for protecting thin dielectrics during processingACTEL CORP·Filed 1989·Granted May 5, 1992·16 cites·1 claims
- 4447US5906043AProgrammable/reprogrammable structure using fuses and antifusesPROLINX LABS CORP·Filed 1997·Granted May 25, 1999·10 cites·17 claims
- 4547US2008096313A1Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer SubstratesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 4646US5856234AMethod of fabricating an antifuseACTEL CORP·Filed 1995·Granted Jan 5, 1999·13 cites·15 claims
- 4746US5825072ACircuits for ESD Protection of metal to-metal antifuses during processingACTEL CORP·Filed 1996·Granted Oct 20, 1998·11 cites·6 claims
- 4845US5519248ACircuits for ESD protection of metal-to-metal antifuses during processingACTEL CORP·Filed 1994·Granted May 21, 1996·11 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →