Inventor · disambiguated record
Stephen M. Dershem
Also filed as: DERSHEM STEPHEN · DERSHEM STEPHEN M
75 granted patents·20 pending applications·3,071 citations·filing 1989–2014
99Inventor score
Files withDESIGNER MOLECULES INC31HENKEL CORP15QUANTUM MATERIALS INC14DERSHEM STEPHEN M13DEXTER CORP7
Top patents by PatentIndex Score
95 records- 0199US7678879B2Adhesive composition of phenol-functional polyamidesDESIGNER MOLECULES INC·Filed 2006·Granted Mar 16, 2010·50 cites·4 claims
- 0298US7517925B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2003·Granted Apr 14, 2009·87 cites·13 claims
- 0398US7285613B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2005·Granted Oct 23, 2007·41 cites·6 claims
- 0498US6743852B2Benzoxazines, thermosetting resins comprised thereof, and methods for use thereofHENKEL CORP·Filed 2001·Granted Jun 1, 2004·102 cites·29 claims
- 0597US8431655B2Curatives for epoxy compositionsDERSHEM STEPHEN M·Filed 2010·Granted Apr 30, 2013·18 cites·12 claims
- 0697US7208566B2Imide-linked maleimide and polymaleimide compoundsDESIGNER MOLECULES INC·Filed 2004·Granted Apr 24, 2007·66 cites·9 claims
- 0797US6790597B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2002·Granted Sep 14, 2004·66 cites·6 claims
- 0897US6211320B1Low viscosity acrylate monomers formulations containing same and uses thereforDEXTER CORP·Filed 1999·Granted Apr 3, 2001·98 cites·14 claims
- 0996US7928153B2Thermosetting polyether oligomers, compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2008·Granted Apr 19, 2011·23 cites·41 claims
- 1096US7875688B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Jan 25, 2011·17 cites·19 claims
- 1196US7157587B2Imide-extended liquid bismaleimide resinDESIGNER MOLECULES INC·Filed 2004·Granted Jan 2, 2007·60 cites·16 claims
- 1296US7102015B2Maleimide compounds in liquid formHENKEL CORP·Filed 2004·Granted Sep 5, 2006·41 cites·11 claims
- 1396US6852814B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2002·Granted Feb 8, 2005·57 cites·11 claims
- 1496US6034195AThermosetting resin compositions containing maleimide and/or vinyl compoundsDEXTER CORP·Filed 1995·Granted Mar 7, 2000·105 cites·12 claims
- 1596US5489641AFreeze resistant die-attach compositionsQUANTUM MATERIALS INC·Filed 1993·Granted Feb 6, 1996·72 cites·13 claims
- 1696US5358992ADie-attach composition comprising polycyanate ester monomerQUANTUM MATERIALS INC·Filed 1993·Granted Oct 25, 1994·81 cites·17 claims
- 1795US6963001B2Low shrinkage thermosetting resin compositions and methods of use thereforHENKEL CORP·Filed 2003·Granted Nov 8, 2005·41 cites·40 claims
- 1895US6825245B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2002·Granted Nov 30, 2004·41 cites·20 claims
- 1995US6121358AHydrophobic vinyl monomers, formulations containing same, and uses thereforDEXTER CORP·Filed 1997·Granted Sep 19, 2000·95 cites·80 claims
- 2095US6034194ABismaleimide-divinyl adhesive compositions and uses thereforQUANTUM MATERIALS DEXTER CORP·Filed 1994·Granted Mar 7, 2000·106 cites·13 claims
- 2195US5973166AMethod for the preparation of maleimidesDEXTER CORP·Filed 1998·Granted Oct 26, 1999·82 cites·18 claims
- 2294US8039663B2Monomers derived from pentacyclopentadecane dimethanolDESIGNER MOLECULES INC·Filed 2008·Granted Oct 18, 2011·12 cites·19 claims
- 2394US8008419B2Siloxane monomers and methods for use thereofDESIGNER MOLECULES INC·Filed 2009·Granted Aug 30, 2011·15 cites·19 claims
- 2494US6521731B2Radical polymerizable compositions containing polycyclic olefinsHENKEL LOCTITE CORP·Filed 2001·Granted Feb 18, 2003·64 cites·28 claims
- 2594US5447988ASolvent free die-attach compositionsQUANTUM MATERIALS INC·Filed 1993·Granted Sep 5, 1995·93 cites·18 claims
- 2693US8415812B2Materials and methods for stress reduction in semiconductor wafer passivation layersDERSHEM STEPHEN M·Filed 2010·Granted Apr 9, 2013·10 cites·20 claims
- 2793US7786234B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Aug 31, 2010·17 cites·13 claims
- 2893US7309724B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2004·Granted Dec 18, 2007·39 cites·17 claims
- 2993US7199249B2Free radically polymerizable coupling agentsHENKEL CORP·Filed 2002·Granted Apr 3, 2007·52 cites·13 claims
- 3093US6620946B2Low shrinkage thermosetting resin compositions and methods of use thereofLOCTITE CORP·Filed 2002·Granted Sep 16, 2003·48 cites·16 claims
- 3193US6423780B1Heterobifunctional monomers and uses thereforLOCTITE·Filed 2001·Granted Jul 23, 2002·71 cites·37 claims
- 3292US8013104B2Thermosetting hyperbranched compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2009·Granted Sep 6, 2011·11 cites·18 claims
- 3392US6960636B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2003·Granted Nov 1, 2005·40 cites·24 claims
- 3491US6946523B2Heterobifunctional monomers and uses thereforHENKEL CORP·Filed 2003·Granted Sep 20, 2005·61 cites·41 claims
- 3591US6916856B2Thermosetting resin compositions containing maleimide and/or vinyl compoundsHENKEL CORP·Filed 2002·Granted Jul 12, 2005·55 cites·3 claims
- 3691US5718941ABleed resistant cyanate ester-containing compositionsQUANTUM MATERIALS INC·Filed 1997·Granted Feb 17, 1998·71 cites·24 claims
- 3791US5717034APerfluorinated hydrocarbon polymer-filled adhesive formulations and uses thereforQUANTUM MATERIALS INC·Filed 1996·Granted Feb 10, 1998·93 cites·18 claims
- 3891US5232962AAdhesive bonding composition with bond line limiting spacer systemQUANTUM MATERIALS INC·Filed 1991·Granted Aug 3, 1993·131 cites·10 claims
- 3990US5861111AMethod for isomerization of arylpropargyl ether monomers and uses thereforDEXTER CORP·Filed 1996·Granted Jan 19, 1999·50 cites·12 claims
- 4089US6187886B1Maleimide containing formulations and uses thereforDEXTER CORP·Filed 1998·Granted Feb 13, 2001·77 cites·25 claims
- 4189US5969036AEpoxy-containing die-attach compositionsDEXTER CORP·Filed 1997·Granted Oct 19, 1999·59 cites·30 claims
- 4289US5646241ABleed resistant cyanate ester-containing compositionsQUANTUM MATERIALS INC·Filed 1995·Granted Jul 8, 1997·65 cites·25 claims
- 4388US7868113B2Low shrinkage polyester thermosetting resinsDESIGNER MOLECULES INC·Filed 2007·Granted Jan 11, 2011·15 cites·23 claims
- 4488US6429281B1Hydrophobic, high Tg cycloaliphatic epoxy resinsLOCTITE·Filed 1999·Granted Aug 6, 2002·63 cites·13 claims
- 4587US8816021B2Curable composition with rubber-like propertiesMIZORI FARHAD G·Filed 2011·Granted Aug 26, 2014·5 cites·20 claims
- 4687US8710682B2Materials and methods for stress reduction in semiconductor wafer passivation layersDESIGNER MOLECULES INC·Filed 2013·Granted Apr 29, 2014·8 cites·22 claims
- 4787US8637611B2Amide-extended crosslinking compounds and methods for use thereofDERSHEM STEPHEN M·Filed 2009·Granted Jan 28, 2014·5 cites·3 claims
- 4887US5064480AWater washable soldering pasteQUANTUM MATERIALS INC·Filed 1989·Granted Nov 12, 1991·50 cites·11 claims
- 4986US8158748B2Hetero-functional compounds and methods for use thereofDERSHEM STEPHEN M·Filed 2009·Granted Apr 17, 2012·5 cites·7 claims
- 5086US5753748ABleed resistant cyanate ester-containing compositionsQUANTUM MATERIALS INC·Filed 1996·Granted May 19, 1998·60 cites·33 claims
Showing the top 50 of 95 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Stephen M. Dershem files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →