Inventor · disambiguated record
Stanley Job Doraisamy
Also filed as: DORAISAMY STANLEY JOB
10 granted patents·1 pending application·21 citations·filing 2005–2018
84Inventor score
Top patents by PatentIndex Score
11 records- 0171US10787361B2Sensor device with flip-chip die and interposerNXP USA INC·Filed 2018·Granted Sep 29, 2020·2 cites·14 claims
- 0265US8110906B2Semiconductor device including isolation layerMAHLER JOACHIM·Filed 2007·Granted Feb 7, 2012·2 cites·14 claims
- 0364US8642394B2Method of manufacturing electronic device on leadframeMOHAMED ABDUL RAHMAN·Filed 2008·Granted Feb 4, 2014·5 cites·17 claims
- 0464US7791182B2Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producingINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 7, 2010·5 cites·17 claims
- 0560US9171786B1Integrated circuit with recess for die attachmentCHAN SOON KANG·Filed 2014·Granted Oct 27, 2015·2 cites·7 claims
- 0659US8067841B2Semiconductor devices having a resin with warpage compensated surfacesHENG CHAI WEI·Filed 2008·Granted Nov 29, 2011·3 cites·25 claims
- 0756US9136399B2Semiconductor package with gel filled cavityDORAISAMY STANLEY JOB·Filed 2013·Granted Sep 15, 2015·2 cites·7 claims
- 0848US7723165B2Method of forming component packageINFINEON TECHNOLOGIES AG·Filed 2008·Granted May 25, 2010·0 cites·19 claims
- 0946US8377753B2Method of fabricating a semiconductor device having a resin with warpage compensated structuresINFINEON TECHNOLOGIES AG·Filed 2011·Granted Feb 19, 2013·0 cites·29 claims
- 1042US2015069537A1Package-on-package semiconductor sensor deviceLO WAI YEW·Filed 2013·Application pending·0 cites
- 1141US9293395B2Lead frame with mold lock structureWONG WAI KEONG·Filed 2014·Granted Mar 22, 2016·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →