Inventor · disambiguated record
Stephen Farrar
Also filed as: FARRAR STEPHEN · FARRAR STEPHEN R
6 granted patents·0 citations·filing 2013–2020
66Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO6
Top patents by PatentIndex Score
6 records- 0163US11183437B2Circuit packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Granted Nov 23, 2021·0 cites·18 claims
- 0256US10685898B2Circuit packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jun 16, 2020·0 cites·15 claims
- 0350US10559512B2Circuit packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Feb 11, 2020·0 cites·20 claims
- 0448US10276468B2Circuit packageHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Apr 30, 2019·0 cites·16 claims
- 0542US9287126B2Multi-wafer pair anodic bonding apparatus and methodHEWLETT PACKARD DEVELOPMENT CO·Filed 2013·Granted Mar 15, 2016·0 cites·11 claims
- 0641US10438864B2Circuit packages comprising epoxy mold compounds and methods of compression moldingHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Oct 8, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →