Inventor · disambiguated record
Stefan Fries
Also filed as: FRIES STEFAN
10 granted patents·4 pending applications·37 citations·filing 2002–2023
85Inventor score
Top patents by PatentIndex Score
14 records- 0183US8382024B2Device for controlling the drive of a reelWAFIOS AG·Filed 2010·Granted Feb 26, 2013·9 cites·19 claims
- 0278US8573019B2Method and apparatus for the production of a bent partSTEINHILBER WERNER·Filed 2010·Granted Nov 5, 2013·9 cites·23 claims
- 0374US9067255B2Bending apparatus for rod-shaped workpiecesFRIES STEFAN·Filed 2012·Granted Jun 30, 2015·7 cites·18 claims
- 0469US9468963B2Bending head for bending rod- and pipe-shaped workpiecesFRIES STEFAN·Filed 2012·Granted Oct 18, 2016·5 cites·19 claims
- 0567US8795479B2Wafer clamp assembly for holding a wafer during a deposition processBICHLER HERMANN·Filed 2006·Granted Aug 5, 2014·5 cites·10 claims
- 0656US12049137B2Vehicle comprising an electrically conductive vehicle part that can be used as a resistor element for converting electrical energy into heatMAN TRUCK & BUS SE·Filed 2020·Granted Jul 30, 2024·0 cites·13 claims
- 0753US12252356B2Method and system of producing coil springsWAFIOS AG·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 0851US11226051B2Valve for drinking water installationKEMPER GEBR GMBH CO KG METALLWERKE·Filed 2020·Granted Jan 18, 2022·0 cites·20 claims
- 0948US2014339074A1Wafer clamp assembly for holding a wafer during a deposition processTEXAS INSTRUMENTS DEUTSCHLAND·Filed 2014·Application pending·0 cites
- 1047US6682635B2Cathodic sputtering chamber for applying material to the surface of a semiconductor wafer located thereinTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 27, 2004·2 cites·8 claims
- 1145US10435871B2Drinking and service water supply device of a building, and regulating valve thereforKEMPER GEBR GMBH CO KG METALLWERKE·Filed 2016·Granted Oct 8, 2019·0 cites·11 claims
- 1245US2023405744A1Forming machine with a plurality of workstationsWAFIOS AG·Filed 2023·Application pending·0 cites
- 1334US2015057897A1Axle assembly housingAGCO INT GMBH·Filed 2013·Application pending·0 cites
- 1428US2015306701A1Method and apparatus for connecting connection elements to the substrate of a power semiconductor module by weldingSEMIKRON ELEKTRONIK GMBH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →