Inventor · disambiguated record
Stephen F. Heng
Also filed as: HENG STEPHEN · HENG STEPHEN F
15 granted patents·1 pending application·141 citations·filing 2009–2016
93Inventor score
Top patents by PatentIndex Score
16 records- 0194US9466900B1Circuit board socket with rail frameHENG STEPHEN F·Filed 2015·Granted Oct 11, 2016·13 cites·20 claims
- 0287US8216887B2Semiconductor chip package with stiffener frame and configured lidHENG STEPHEN F·Filed 2009·Granted Jul 10, 2012·17 cites·21 claims
- 0386US8425246B1Low profile semiconductor device socketHENG STEPHEN F·Filed 2011·Granted Apr 23, 2013·8 cites·20 claims
- 0483USD641720SCircuit package lidADVANCED MICRO DEVICES INC·Filed 2010·Granted Jul 19, 2011·29 cites·1 claims
- 0583USD633879SSocket capADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·32 cites·1 claims
- 0665US8938876B2Method of mounting a circuit boardHENG STEPHEN F·Filed 2011·Granted Jan 27, 2015·1 cites·17 claims
- 0763US8837162B2Circuit board socket with support structureHENG STEPHEN·Filed 2010·Granted Sep 16, 2014·2 cites·20 claims
- 0857USD633880SSocket housingADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·8 cites·1 claims
- 0953USD645426SSocket assemblyADVANCED MICRO DEVICES INC·Filed 2010·Granted Sep 20, 2011·7 cites·1 claims
- 1053USD633877SSocket frameADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·8 cites·1 claims
- 1147USD633878SSocket cover capADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·7 cites·1 claims
- 1246US10389053B2Circuit board socket with rail frameHENG STEPHEN F·Filed 2016·Granted Aug 20, 2019·0 cites·20 claims
- 1345US2014043768A1Package retention frameHARDIKAR MAHESH·Filed 2012·Application pending·0 cites
- 1444USD648688SSocket housingHENG STEPHEN·Filed 2011·Granted Nov 15, 2011·4 cites·1 claims
- 1537USD658607SCircuit package lidHENG STEPHEN·Filed 2011·Granted May 1, 2012·3 cites·1 claims
- 1636USD661667SSocket assemblyHENG STEPHEN·Filed 2011·Granted Jun 12, 2012·2 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Stephen F. Heng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →