Inventor · disambiguated record
Steven Hovey
Also filed as: HOVEY STEVEN · HOVEY STEVEN H
10 granted patents·2 pending applications·260 citations·filing 2000–2023
91Inventor score
Top patents by PatentIndex Score
12 records- 0197US7220594B2Method and apparatus for sorting particles with a MEMS deviceINNOVATIVE MICRO TECHNOLOGY·Filed 2005·Granted May 22, 2007·76 cites·20 claims
- 0293US7229838B2MEMS actuator and method of manufacture for MEMS particle sorting deviceINNOVATIVE MICRO TECHNOLOGY·Filed 2005·Granted Jun 12, 2007·47 cites·24 claims
- 0389US7972683B2Wafer bonding material with embedded conductive particlesINNOVATIVE MICRO TECHNOLOGY·Filed 2007·Granted Jul 5, 2011·21 cites·20 claims
- 0486US7675162B2Interconnect structure using through wafer vias and method of fabricationINNOVATIVE MICRO TECHNOLOGY·Filed 2006·Granted Mar 9, 2010·17 cites·24 claims
- 0583US6578436B1Method and apparatus for pressure sensingFIDELICA MICROSYSTEMS INC·Filed 2000·Granted Jun 17, 2003·48 cites·95 claims
- 0679US10613281B2Method and system for coupling a light source assembly to an optical integrated circuitLUXTERA INC·Filed 2019·Granted Apr 7, 2020·2 cites·21 claims
- 0779US10345540B2Method and system for coupling a light source assembly to an optical integrated circuitLUXTERA INC·Filed 2018·Granted Jul 9, 2019·2 cites·21 claims
- 0877US7968986B2Lid structure for microdevice and method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2007·Granted Jun 28, 2011·8 cites·9 claims
- 0967US7059201B2Use of multi-layer thin films as stress sensorsFIDELICA MICROSYSTEMS INC·Filed 2000·Granted Jun 13, 2006·22 cites·85 claims
- 1067US6829950B2Method and apparatus for pressure sensingFIDELICA MICROSYSTEMS INC·Filed 2002·Granted Dec 14, 2004·17 cites·5 claims
- 1157US2025028114A1Integrated lens in laser micro package through wafer fabricationCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1243US2006266692A1Microfabricated cross flow filter and method of manufactureINNOVATIVE MICRO TECHNOLOGY·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →