Inventor · disambiguated record
Stephen M. Hugo
Also filed as: HUGO STEPHEN · HUGO STEPHEN M · HUGO STEPHEN MICHAEL
28 granted patents·3 pending applications·40 citations·filing 2013–2023
93Inventor score
Files withIBM31
Top patents by PatentIndex Score
31 records- 0196US10575448B1Electromagnetic shielding of heat sinks with shape-memory alloy groundingIBM·Filed 2018·Granted Feb 25, 2020·20 cites·20 claims
- 0296US10048312B1Testing printed circuit board assemblyIBM·Filed 2017·Granted Aug 14, 2018·9 cites·1 claims
- 0394US11699884B2Electromagnetic shielding of heatsinks with spring press-fit pinsIBM·Filed 2020·Granted Jul 11, 2023·4 cites·4 claims
- 0484US10168383B2Testing printed circuit board assemblyIBM·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
- 0576US10262907B1Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2017·Granted Apr 16, 2019·2 cites·13 claims
- 0674US10679926B2Method of making integrated die paddle structures for bottom terminated componentsIBM·Filed 2017·Granted Jun 9, 2020·1 cites·11 claims
- 0768US12256494B2Modified internal clearance(s) at connector pin aperture(s) of a circuit boardIBM·Filed 2022·Granted Mar 18, 2025·0 cites·25 claims
- 0867US10677856B2Facilitating reliable circuit board press-fit connector assembly fabricationIBM·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 0962US10073134B2Laminate bond strength detectionIBM·Filed 2017·Granted Sep 11, 2018·0 cites·20 claims
- 1062US9427828B2Increasing solder hole-fill in a printed circuit board assemblyIBM·Filed 2014·Granted Aug 30, 2016·0 cites·15 claims
- 1160US11906574B2Hybrid socket warp indicatorIBM·Filed 2021·Granted Feb 20, 2024·0 cites·7 claims
- 1260US9232664B2Heat transfer device for wave solderingIBM·Filed 2013·Granted Jan 5, 2016·0 cites·20 claims
- 1359US2025166401A1Hardware integrity validationIBM·Filed 2023·Application pending·0 cites
- 1458US10593601B2Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2019·Granted Mar 17, 2020·0 cites·11 claims
- 1558US10559522B2Integrated die paddle structures for bottom terminated componentsIBM·Filed 2018·Granted Feb 11, 2020·0 cites·6 claims
- 1658US9986649B2Increasing solder hole-fill in a printed circuit board assemblyIBM·Filed 2017·Granted May 29, 2018·0 cites·15 claims
- 1758US9910085B2Laminate bond strength detectionIBM·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 1858US9148962B2Heat transfer device for wave solderingIBM·Filed 2013·Granted Sep 29, 2015·0 cites·11 claims
- 1958US2025093106A1Infrared sensor turret for reflow ovensIBM·Filed 2023·Application pending·0 cites
- 2057US9714870B2Solder assembly temperature monitoring processIBM·Filed 2013·Granted Jul 25, 2017·0 cites·13 claims
- 2157US9662732B2Increasing solder hole-fill in a printed circuit board assemblyIBM·Filed 2016·Granted May 30, 2017·0 cites·17 claims
- 2256US11445650B2Localized rework using liquid media solderingIBM·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 2355US12100910B2Shape-memory alloy lock for connectorsIBM·Filed 2021·Granted Sep 24, 2024·0 cites·13 claims
- 2455US2024170903A1Controlled extraction of electronic connector from electronic connector boardIBM·Filed 2022·Application pending·0 cites
- 2553US10083894B2Integrated die paddle structures for bottom terminated componentsIBM·Filed 2015·Granted Sep 25, 2018·0 cites·8 claims
- 2652US9733134B2Solder assembly temperature monitoring processIBM·Filed 2015·Granted Aug 15, 2017·0 cites·6 claims
- 2751US10834839B1Barrier for hybrid socket movement reductionIBM·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 2850US11245238B2Tool for shaping contact tab interconnects at a circuit card edgeIBM·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 2949US11175100B2Heat sinks using memory shaping materialsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·10 claims
- 3048US11211760B2Stutter step press-fit connector insertion processIBM·Filed 2019·Granted Dec 28, 2021·0 cites·7 claims
- 3145US11268809B2Detecting and correcting deficiencies in surface conditions for bonding applicationsIBM·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →