Inventor · disambiguated record
Steven A. Klein
Also filed as: KLEIN STEVEN · KLEIN STEVEN A · KLEIN STEVEN ADAM
14 granted patents·21 pending applications·53 citations·filing 1998–2024
87Inventor score
Top patents by PatentIndex Score
35 records- 0193US11481118B2Storage media programming with adaptive write buffer releaseMARVELL ASIA PTE LTD·Filed 2020·Granted Oct 25, 2022·5 cites·20 claims
- 0291US10455685B1Electronic device, socket, and spacer to alter socket profileINTEL CORP·Filed 2018·Granted Oct 22, 2019·12 cites·20 claims
- 0386US11646244B2Socket loading mechanism for passive or active socket and package coolingINTEL CORP·Filed 2019·Granted May 9, 2023·4 cites·20 claims
- 0470US10634594B2Membrane test for mechanical testing of stretchable electronicsINTEL CORP·Filed 2016·Granted Apr 28, 2020·1 cites·23 claims
- 0568US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0665US12444664B2Loading frame for high I/O count packaged semiconductor chipSK HYNIX NAND PRODUCT SOLUTIONS CORP·Filed 2020·Granted Oct 14, 2025·0 cites·20 claims
- 0763US12413001B2Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic packageINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·25 claims
- 0863US12127363B2Compression mounted technology (CMT) socket retention mechanisms to board or interposerINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·25 claims
- 0962US2025055217A1Pins for use in land grid arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 1061US2025014967A1Methods and apparatus to improve thermal dissipation and mechanical loading of integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 1161US2024355758A1Methods and apparatus to reduce stress between sockets and associated integrated circuit packages having glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1260US2025024622A1Protrusions of socket bodies having metalINTEL CORP·Filed 2024·Application pending·0 cites
- 1358US2025174922A1Damping elements for pin vibration fretting risk mitigationINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US2025112392A1Semiconductor package carrier, and a corresponding system and method of useINTEL CORP·Filed 2024·Application pending·0 cites
- 1557US2024355702A1Integrated circuit packages with dampeners to reduce vibration effectsGENG PHIL·Filed 2024·Application pending·0 cites
- 1657US2024357744A1Integrated circuit packages including carriers with incorporated substrates and interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 1756US11916322B2Dual-sided socket device with corrugation structuresINTEL CORP·Filed 2020·Granted Feb 27, 2024·0 cites·20 claims
- 1856US2025280499A1Methods and apparatus to connect a semiconductor package to a circuit boardINTEL CORP·Filed 2024·Application pending·0 cites
- 1955US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 2054US11569596B2Pressure features to alter the shape of a socketINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·17 claims
- 2153US6212641B1Method and apparatus for improving power characteristics in a system having a reduced power modeINSIDE OUT NETWORKS·Filed 1998·Granted Apr 3, 2001·31 cites·8 claims
- 2252US2024349457A1Damping assemblies for heat sinks and related methodsGENG PHIL·Filed 2024·Application pending·0 cites
- 2351US12009612B2Dual-sided socket device with corrugation structures and shield structuresINTEL CORP·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 2451US11818832B2Socket load regulation utilizing CPU carriers with shim componentsINTEL CORP·Filed 2020·Granted Nov 14, 2023·0 cites·7 claims
- 2551US2024222288A1Socket interface frames for devices with improved-performance substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 2650US11581671B2Integrated circuit package socket housing to enhance package coolingINTEL CORP·Filed 2019·Granted Feb 14, 2023·0 cites·20 claims
- 2750US2024113479A1Socket interconnect structures and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 2849US2024297119A1Liquid metal connection device and methodINTEL CORP·Filed 2021·Application pending·0 cites
- 2944US2022069532A1Electronic socket pin for self-retention to a conductive interposerINTEL CORP·Filed 2020·Application pending·0 cites
- 3043US2007130026A1Method and system for providing business listings utilizing time based weightingsCONTROL RESOURCES LLC·Filed 2006·Application pending·0 cites
- 3139US2017269017A1Inflatable Bladder Based Mechanical Testing for Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 3238US2018089984A1Device, system and method for detecting degradation of a flexible circuitINTEL CORP·Filed 2016·Application pending·0 cites
- 3338US2017268972A1Lateral Expansion Apparatus for Mechanical Testing of Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 3430US2017287873A1Electronic assembly components with corner adhesive for warpage reduction during thermal processingSANKARASUBRAMANIAN SANTOSH·Filed 2016·Application pending·0 cites
- 3527US2017287799A1Removable ic package stiffenerKLEIN STEVEN A·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →