Inventor · disambiguated record
Stanley Shengqian Kong
Also filed as: KONG STANLEY SHENGQIAN
2 granted patents·2 pending applications·0 citations·filing 2019–2024
23Inventor score
Top patents by PatentIndex Score
4 records- 0160US12460065B2Thermal interface materials based on two-part polyurethanesHENKEL AG & CO KGAA·Filed 2021·Granted Nov 4, 2025·0 cites·21 claims
- 0259US2023183542A1Low viscosity thermally conductive pasteHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0358US2024199792A1Two-component curable compositionsHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0438US12139568B2High temperature, conductive thermosetting resin compositionsTCLAD INC·Filed 2019·Granted Nov 12, 2024·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Stanley Shengqian Kong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →