Inventor · disambiguated record
Steffen Kroehnert
Also filed as: KROEHNERT STEFFEN
5 granted patents·8 pending applications·51 citations·filing 2004–2008
79Inventor score
Top patents by PatentIndex Score
13 records- 0186US8004072B2Packaging systems and methodsQIMONDA AG·Filed 2008·Granted Aug 23, 2011·17 cites·14 claims
- 0278US8410595B2Semiconductor device with chip mounted on a substrateKROEHNERT STEFFEN·Filed 2007·Granted Apr 2, 2013·16 cites·42 claims
- 0371US7518220B2Substrate for an FBGA semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·8 cites·16 claims
- 0457US7030473B2Substrate-based IC packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 18, 2006·8 cites·12 claims
- 0545US6949820B2Substrate-based chip packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 27, 2005·2 cites·16 claims
- 0638US2007090527A1Integrated chip device in a packageTHOMAS JOCHEN·Filed 2005·Application pending·0 cites
- 0736US2006237855A1Substrate for producing a soldering connection to a second substrateKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
- 0835US2006270109A1Manufacturing method for an electronic component assembly and corresponding electronic component assemblyBLASZCZAK STEPHAN·Filed 2005·Application pending·0 cites
- 0932US2006255504A1Method and casting mold for producing a protective layer on integrated componentsKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
- 1031US2006017149A1Substrate-based BGA package, in particular FBGA packageREISS MARTIN·Filed 2005·Application pending·0 cites
- 1130US2005285247A1Substrate-based die package with BGA or BGA-like componentsREISS MARTIN·Filed 2005·Application pending·0 cites
- 1228US2005093175A1Arrangement for improving the reliability of semiconductor modulesFiled 2004·Application pending·0 cites
- 1328US2006180921A1Method for producing an FBGA component and substrate for carrying out the methodKROEHNERT STEFFEN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →