Inventor · disambiguated record
Stefan Patrick Lindt
Also filed as: LINDT STEFAN · LINDT STEFAN PATRICK
0 granted patents·10 pending applications·0 citations·filing 2022–2025
Files withBOSCH GMBH ROBERT9LAIR LIQUIDE SA POUR LETUDE ET L’EXPLOITATION DES PROCEDES GEORGES CLAUDE1
Top patents by PatentIndex Score
10 records- 0159US2025252352A1Method and apparatus for generating synthetic time seriesBOSCH GMBH ROBERT·Filed 2025·Application pending·0 cites
- 0254US2025052814A1Prediction of Failure Probabilities of Chips of a WaferBOSCH GMBH ROBERT·Filed 2024·Application pending·0 cites
- 0353US2025321161A1Computer-Implemented Method for Quantifying the Relevance of Measured Values in Time SeriesBOSCH GMBH ROBERT·Filed 2025·Application pending·0 cites
- 0452US2025020714A1Uncertainty estimation for a position reconstruction of semiconductor components on a waferBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 0550US2024012877A1Method and Apparatus for Production Process Optimization based on Determined Correlations between First and Second Measurements from Production ProcessesBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 0649US2025265499A1Method and Apparatus for Feature Extraction of Time Series and Generation of Synthetic Time Series Based on the Extracted FeaturesBOSCH GMBH ROBERT·Filed 2025·Application pending·0 cites
- 0749US2025167052A1Position reconstruction of semiconductor components on a waferBOSCH GMBH ROBERT·Filed 2023·Application pending·0 cites
- 0849US2024280626A1Computer-Implemented Method for Optimizing a Detection Threshold of a Prediction ModelBOSCH GMBH ROBERT·Filed 2024·Application pending·0 cites
- 0946US2023066599A1Method and Apparatus for Reconstructing the Position of Semiconductor Components on a WaferBOSCH GMBH ROBERT·Filed 2022·Application pending·0 cites
- 1040US2023382735A1Helium recovery processLAIR LIQUIDE SA POUR LETUDE ET L’EXPLOITATION DES PROCEDES GEORGES CLAUDE·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →