Inventor · disambiguated record
Stefanie M. Lotz
Also filed as: LOTZ STEFANIE · LOTZ STEFANIE M
19 granted patents·4 pending applications·273 citations·filing 2005–2024
94Inventor score
Top patents by PatentIndex Score
23 records- 0198US8227904B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2009·Granted Jul 24, 2012·174 cites·3 claims
- 0296US9831169B2Integrated circuit package substrateINTEL CORP·Filed 2016·Granted Nov 28, 2017·14 cites·15 claims
- 0395US10763216B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2019·Granted Sep 1, 2020·7 cites·19 claims
- 0495US9548264B2High density organic bridge device and methodINTEL CORP·Filed 2016·Granted Jan 17, 2017·10 cites·20 claims
- 0594US9119313B2Package substrate with high density interconnect design to capture conductive features on embedded dieINTEL CORP·Filed 2013·Granted Aug 25, 2015·23 cites·25 claims
- 0693US9875969B2Multi-chip package and method of providing die-to-die interconnects in sameBRAUNISCH HENNING·Filed 2012·Granted Jan 23, 2018·12 cites·6 claims
- 0793US9508636B2Integrated circuit package substrateINTEL CORP·Filed 2013·Granted Nov 29, 2016·14 cites·14 claims
- 0891US10923429B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2020·Granted Feb 16, 2021·2 cites·20 claims
- 0991US10510669B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2018·Granted Dec 17, 2019·4 cites·7 claims
- 1089US2024429173A1Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2024·Application pending·0 cites
- 1186US12113026B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1286US9202803B2Laser cavity formation for embedded dies or components in substrate build-up layersZHANG CHONG·Filed 2014·Granted Dec 1, 2015·8 cites·14 claims
- 1386US2024321762A1High density organic bridge device and methodINTEL CORP·Filed 2024·Application pending·0 cites
- 1482US11824008B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·24 claims
- 1581US10103105B2High density organic bridge device and methodINTEL CORP·Filed 2016·Granted Oct 16, 2018·2 cites·20 claims
- 1679US10672713B2High density organic bridge device and methodINTEL CORP·Filed 2018·Granted Jun 2, 2020·1 cites·22 claims
- 1775US11876053B2Multi-chip package and method of providing die-to-die interconnects in sameINTEL CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 1874US10325843B2Integrated circuit package substrateINTEL CORP·Filed 2017·Granted Jun 18, 2019·1 cites·19 claims
- 1973US12002762B2High density organic bridge device and methodINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·19 claims
- 2062US10770387B2Integrated circuit package substrateINTEL CORP·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 2158US7332429B2Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substratesINTEL CORP·Filed 2005·Granted Feb 19, 2008·1 cites·4 claims
- 2242US2008001297A1Laser patterning and conductive interconnect/materials forming techniques for fine line and space featuresLOTZ STEFANIE·Filed 2006·Application pending·0 cites
- 2342US2015048515A1Fabrication of a substrate with an embedded die using projection patterning and associated package configurationsZHANG CHONG·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →