Inventor · disambiguated record
Steffany Ann Lacierda Moreno
Also filed as: MORENO STEFFANY ANN LACIERDA
5 granted patents·3 pending applications·1 citations·filing 2019–2024
63Inventor score
Files withTEXAS INSTRUMENTS INC8
Top patents by PatentIndex Score
8 records- 0179US11637083B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 25, 2023·1 cites·18 claims
- 0272US2025022841A1Semiconductor device assembly with pre-reflowed solderTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0371US2023187223A1Semiconductor package with flip chip solder joint capsulesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0470US12266631B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 1, 2025·0 cites·15 claims
- 0561US12132027B2Semiconductor device assembly with pre-reflowed solderTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 29, 2024·0 cites·26 claims
- 0656US11600498B2Semiconductor package with flip chip solder joint capsulesTEXAS INSTRUMENTS INC·Filed 2019·Granted Mar 7, 2023·0 cites·26 claims
- 0754US11929308B2Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·24 claims
- 0836US2021066239A1Packaged semiconductor devices with uniform solder jointsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →