Inventor · disambiguated record
Stephan Neugebauer
Also filed as: NEUGEBAUER STEPHAN
10 granted patents·6 pending applications·13 citations·filing 1998–2025
81Inventor score
Top patents by PatentIndex Score
16 records- 0173US11756857B2Electronic circuit, power converter, and method for producing an electronic circuitSIEMENS AG·Filed 2020·Granted Sep 12, 2023·1 cites·39 claims
- 0273US2025347479A1Heat pipe heat sink for a pulsating operation, and method for producing a heat pipe heat sink of this kindSIEMENS AG·Filed 2025·Application pending·0 cites
- 0369US11129301B2Thermally conductive insulatorSIEMENS AG·Filed 2017·Granted Sep 21, 2021·3 cites·12 claims
- 0463US8650865B2Exhaust gas routing device for an internal combustion engine having a thermoelectrical generatorNEUGEBAUER STEPHAN·Filed 2011·Granted Feb 18, 2014·3 cites·8 claims
- 0558US2024053113A1Heat pipe heat sink for a pulsating operation, and method for producing a heat pipe heat sink of this kindSIEMENS AG·Filed 2021·Application pending·0 cites
- 0655US11677311B2Converter with active damping of the intermediate circuit voltageSIEMENS AG·Filed 2020·Granted Jun 13, 2023·0 cites·6 claims
- 0753US12211629B2Contact system having reliable insulationSIEMENS AG·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 0850US2023307250A1Method for producing an apparatus having a metal body for cooling a semiconductor arrangementSIEMENS AG·Filed 2023·Application pending·0 cites
- 0950US2025118627A1Hybrid heat sinkSIEMENS AG·Filed 2022·Application pending·0 cites
- 1049US2024414894A1Thermally conductive mountSIEMENS AG·Filed 2022·Application pending·0 cites
- 1147US2024363487A1Semiconductor module with a substrate and at least one semiconductor component contacted on the substrateSIEMENS AG·Filed 2022·Application pending·0 cites
- 1244US11723177B2Cooling device with fiber attachment between heating tube and cooling elementSIEMENS AG·Filed 2019·Granted Aug 8, 2023·0 cites·15 claims
- 1341US10306794B2Electrical circuit arrangement having a capacitor with a housing functionSIEMENS AG·Filed 2016·Granted May 28, 2019·0 cites·19 claims
- 1437US10420220B2Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assemblySIEMENS AG·Filed 2017·Granted Sep 17, 2019·0 cites·14 claims
- 1533US10699984B2Semiconductor module with a supporting structure on the bottom sideSIEMENS AG·Filed 2017·Granted Jun 30, 2020·0 cites·9 claims
- 1631US6095120AFuel injection system and method for an air-compressing internal-combustion engineBAYERISCHE MOTOREN WERKE AG·Filed 1998·Granted Aug 1, 2000·6 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →