Inventor · disambiguated record
Stephen Parker
Also filed as: PARKER STEPHEN · PARKER STEPHEN CRAIG
11 granted patents·124 citations·filing 2007–2020
89Inventor score
Top patents by PatentIndex Score
11 records- 0197US9613831B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2015·Granted Apr 4, 2017·64 cites·27 claims
- 0294US9960145B2Flip chip module with enhanced propertiesQORVO US INC·Filed 2016·Granted May 1, 2018·15 cites·25 claims
- 0390US8720051B2Conformal shielding process using process gasesLEAHY DONALD JOSEPH·Filed 2011·Granted May 13, 2014·10 cites·29 claims
- 0490US8186048B2Conformal shielding process using process gasesLEAHY DONALD JOSEPH·Filed 2007·Granted May 29, 2012·15 cites·20 claims
- 0588US9661739B2Electronic modules having grounded electromagnetic shieldsRF MICRO DEVICES INC·Filed 2015·Granted May 23, 2017·6 cites·8 claims
- 0686US8959762B2Method of manufacturing an electronic moduleLEAHY DONALD JOSEPH·Filed 2011·Granted Feb 24, 2015·9 cites·23 claims
- 0774US10020206B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2016·Granted Jul 10, 2018·2 cites·19 claims
- 0873US11387190B2Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulationQORVO US INC·Filed 2020·Granted Jul 12, 2022·1 cites·11 claims
- 0971US10461043B1Method of manufacturing an electromagnetic shieldQORVO US INC·Filed 2018·Granted Oct 29, 2019·2 cites·21 claims
- 1048US11596058B2Fiducials for laminate structuresQORVO US INC·Filed 2019·Granted Feb 28, 2023·0 cites·17 claims
- 1146US10811364B2Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulationQORVO US INC·Filed 2019·Granted Oct 20, 2020·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →