Inventor · disambiguated record
Stefano Schiaffino
Also filed as: SCHIAFFINO STEFANO
44 granted patents·8 pending applications·1,217 citations·filing 1998–2021
98Inventor score
Files withFINISAR CORP13KONINKLIJKE PHILIPS NV8HEWLETT PACKARD CO5KONINKL PHILIPS ELECTRONICS NV5BIO RAD LABORATORIES INC4
Top patents by PatentIndex Score
52 records- 0198US9409174B2Microfluidic system with fluid pickupsBIO RAD LABORATORIES INC·Filed 2014·Granted Aug 9, 2016·72 cites·20 claims
- 0298US6062681ABubble valve and bubble valve-based pressure regulatorHEWLETT PACKARD CO·Filed 1998·Granted May 16, 2000·210 cites·28 claims
- 0397US9687848B2Microfluidic system with fluid pickupsBIO RAD LABORATORIES INC·Filed 2016·Granted Jun 27, 2017·17 cites·17 claims
- 0497US7439449B1Flexible circuit for establishing electrical connectivity with optical subassemblyFINISAR CORP·Filed 2003·Granted Oct 21, 2008·157 cites·7 claims
- 0597US7348212B2Interconnects for semiconductor light emitting devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2005·Granted Mar 25, 2008·62 cites·20 claims
- 0697US6367903B1Alignment of ink dots in an inkjet printerHEWLETT PACKARD CO·Filed 1998·Granted Apr 9, 2002·221 cites·4 claims
- 0793US7736945B2LED assembly having maximum metal support for laser lift-off of growth substratePHILIPS LUMILEDS LIGHTING CO·Filed 2006·Granted Jun 15, 2010·35 cites·11 claims
- 0891US6996304B2Small form factor transceiver with externally modulated laserFINISAR CORP·Filed 2005·Granted Feb 7, 2006·21 cites·20 claims
- 0991US6703561B1Header assembly having integrated cooling deviceFINISAR CORP·Filed 2002·Granted Mar 9, 2004·60 cites·49 claims
- 1090US6364447B1Correction system for droplet placement errors in the scan axis in inkjet printersHEWLETT PACKARD CO·Filed 2000·Granted Apr 2, 2002·58 cites·20 claims
- 1189US7842963B2Electrical contacts for a semiconductor light emitting apparatusKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Granted Nov 30, 2010·17 cites·23 claims
- 1286US6586678B1Ceramic header assemblyFINISAR CORP·Filed 2002·Granted Jul 1, 2003·42 cites·31 claims
- 1384US6867368B2Multi-layer ceramic feedthrough structure in a transmitter optical subassemblyFINISAR CORP·Filed 2003·Granted Mar 15, 2005·31 cites·50 claims
- 1481US10682647B2Microfluidic system with fluid pickupsBIO RAD LABORATORIES·Filed 2017·Granted Jun 16, 2020·1 cites·7 claims
- 1581US8384118B2LED assembly having maximum metal support for laser lift-off of growth substrateKONINKL PHILIPS ELECTRONICS NV·Filed 2010·Granted Feb 26, 2013·6 cites·13 claims
- 1680US7210859B2Optoelectronic components with multi-layer feedthrough structureFINISAR CORP·Filed 2004·Granted May 1, 2007·23 cites·20 claims
- 1779US9246061B2LED having vertical contacts redistruted for flip chip mountingLEI JIPU·Filed 2012·Granted Jan 26, 2016·6 cites·9 claims
- 1879US6327397B1System and method for providing temperature control for a thermally activated optical switch using constant total powerAGILENT TECHNOLOGIES INC·Filed 2000·Granted Dec 4, 2001·22 cites·22 claims
- 1978US6852928B2Cooled externally modulated laser for transmitter optical subassemblyFINISAR CORP·Filed 2003·Granted Feb 8, 2005·24 cites·26 claims
- 2075US11779925B2System, method, and device for forming an array of emulsionsBIO RAD LABORATORIES INC·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 2175US6841733B2Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assemblyFINISAR CORP·Filed 2003·Granted Jan 11, 2005·24 cites·34 claims
- 2273US6188815B1Optical switching device and method utilizing fluid pressure control to improve switching characteristicsAGILENT TECHNOLOGIES INC·Filed 1999·Granted Feb 13, 2001·38 cites·19 claims
- 2371US9324927B2Semiconductor light emitting device with thick metal layersKONINKL PHILIPS NV·Filed 2012·Granted Apr 26, 2016·1 cites·17 claims
- 2470US8202741B2Method of bonding a semiconductor device using a compliant bonding structureNEFF JAMES G·Filed 2009·Granted Jun 19, 2012·4 cites·15 claims
- 2570US6878875B2Small form factor optical transceiver with extended transmission rangeFINISAR CORP·Filed 2003·Granted Apr 12, 2005·14 cites·12 claims
- 2668US8053905B2Compliant bonding structures for semiconductor devicesKONINKL PHILIPS ELECTRONICS NV·Filed 2010·Granted Nov 8, 2011·2 cites·19 claims
- 2765US9093630B2Light emitting device with reduced EPI stressDIANA FREDERIC STEPHANE·Filed 2011·Granted Jul 28, 2015·1 cites·6 claims
- 2862US10020431B2Sealed semiconductor light emitting deviceKONINKLIJKE PHILIPS NV·Filed 2013·Granted Jul 10, 2018·1 cites·24 claims
- 2962US6911599B2Header assembly for optoelectronic devicesFINISAR CORP·Filed 2004·Granted Jun 28, 2005·8 cites·42 claims
- 3061US9076944B2Method of bonding a semiconductor device using a compliant bonding structureNEFF JAMES G·Filed 2012·Granted Jul 7, 2015·1 cites·19 claims
- 3160US9484513B2Semiconductor light emitting device with thick metal layersKONINKLIJKE PHILIPS NV·Filed 2016·Granted Nov 1, 2016·0 cites·19 claims
- 3260US7066659B2Small form factor transceiver with externally modulated laserFINISAR CORP·Filed 2003·Granted Jun 27, 2006·9 cites·12 claims
- 3359US11207685B2System, method, and device for forming an array of emulsionsBIO RAD LABORATORIES·Filed 2018·Granted Dec 28, 2021·0 cites·17 claims
- 3459US9406857B2Chip scale light emitting device with metal pillars in a molding compound formed at wafer levelKONINKLIJKE PHILIPS NV·Filed 2013·Granted Aug 2, 2016·1 cites·12 claims
- 3559US7977132B2Extension of contact pads to the die edge via electrical isolationKONINKL PHILIPS ELECTRONICS NV·Filed 2009·Granted Jul 12, 2011·1 cites·16 claims
- 3658US6390585B1Selectively warming a printhead for optimized performanceHEWLETT PACKARD CO·Filed 1998·Granted May 21, 2002·18 cites·26 claims
- 3756US10170675B2P—N separation metal fill for flip chip LEDsLUMILEDS LLC·Filed 2017·Granted Jan 1, 2019·0 cites·20 claims
- 3852US9722137B2LED having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2016·Granted Aug 1, 2017·0 cites·6 claims
- 3952US9722161B2P-n separation metal fill for flip chip LEDsKONINKLIJKE PHILIPS NV·Filed 2015·Granted Aug 1, 2017·0 cites·19 claims
- 4052US2018019370A1Led having vertical contacts redistributed for flip chip mountingKONINKLIJKE PHILIPS NV·Filed 2017·Application pending·0 cites
- 4151US2018323353A1Sealed semiconductor light emitting deviceLUMILEDS LLC·Filed 2018·Application pending·0 cites
- 4250US9660164B2Light emitting device with reduced epi stressKONINKLIJKE PHILIPS NV·Filed 2015·Granted May 23, 2017·0 cites·12 claims
- 4350US7354201B2Devices for reflection reduction in optical devicesFINISAR CORP·Filed 2003·Granted Apr 8, 2008·3 cites·23 claims
- 4450US2008142833A1Interconnects for semiconductor light emitting devicesPHILIPS LUMILEDS LIGHTING CO·Filed 2008·Application pending·0 cites
- 4548US2011018013A1Thin-film flip-chip series connected ledsKONINKL PHILIPS ELECTRONICS NV·Filed 2009·Application pending·0 cites
- 4643US9935069B2Reducing solder pad topology differences by planarizationLUMILEDS LLC·Filed 2014·Granted Apr 3, 2018·0 cites·11 claims
- 4743US9608016B2Method of separating a wafer of semiconductor devicesKONINKLIJKE PHILIPS NV·Filed 2013·Granted Mar 28, 2017·0 cites·20 claims
- 4843US2018209874A1Assay performance systems including aqueous sample stabilizationBIO RAD LABORATORIES·Filed 2018·Application pending·0 cites
- 4942US2017189908A1Droplet assay system with automatic calibrationBIO RAD LABORATORIES INC·Filed 2016·Application pending·0 cites
- 5039US6276777B1Variable maximum operating temperature for a printheadHEWLETT PACKARD CO·Filed 1998·Granted Aug 21, 2001·6 cites·11 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →