Inventor · disambiguated record
Stefanie Stapf
Also filed as: STAPF STEFANIE
4 granted patents·6 pending applications·1 citations·filing 2022–2025
55Inventor score
Files withHENKEL AG & CO KGAA10
Top patents by PatentIndex Score
10 records- 0185US12180398B2One component (1K) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2022·Granted Dec 31, 2024·1 cites·19 claims
- 0272US12448547B2Heat separable two-layer adhesive system and process of adhesive debonding using the sameHENKEL AG & CO KGAA·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 0369US2025115788A1Two component (2k) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0466US2023407150A1One component (1k) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0564US12398302B2Two component (2K) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 0661US12454635B2Two component (2K) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2022·Granted Oct 28, 2025·0 cites·15 claims
- 0755US2024191108A1Two component (2k) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0853US2025215291A1Curable and electrically debondable one-component (1K) structural adhesive compositionHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0952US2025197700A1One component (1k) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 1049US2025197691A1Debondable solvent-borne pressure sensitive adhesive (psa)HENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →