Inventor · disambiguated record
Stefan Stegmeier
Also filed as: STEGMEIER STEFAN
13 granted patents·13 pending applications·66 citations·filing 2010–2024
88Inventor score
Files withSIEMENS AG15SIEMENS HEALTHCARE GMBH3FLEISCHER MAXIMILIAN2OSRAM OPTO SEMICONDUCTORS GMBH2FLEISCHER MAXIMILLIAN1
Top patents by PatentIndex Score
26 records- 0195US8683845B2Carbon dioxide sensor and associated method for generating a gas measurement valueFLEISCHER MAXIMILIAN·Filed 2010·Granted Apr 1, 2014·25 cites·15 claims
- 0289US12096541B2X-ray high-voltage generator with an oscillating heat pipeSIEMENS HEALTHCARE GMBH·Filed 2023·Granted Sep 17, 2024·1 cites·16 claims
- 0388US9523665B2Device and method for determining carbon dioxide content of airFLEISCHER MAXIMILLIAN·Filed 2012·Granted Dec 20, 2016·16 cites·13 claims
- 0486US12029593B2X-ray high-voltage generator having a two-phase cooling systemSIEMENS HEALTHCARE GMBH·Filed 2023·Granted Jul 9, 2024·1 cites·20 claims
- 0582US9653670B2Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2013·Granted May 16, 2017·6 cites·20 claims
- 0680US8920627B2Selective detector for carbon monoxideFLEISCHER MAXIMILIAN·Filed 2010·Granted Dec 30, 2014·13 cites·17 claims
- 0779US2024397601A1X-ray high-voltage generator with an oscillating heat pipeSiemens Healthineers Ag·Filed 2024·Application pending·0 cites
- 0872US10741474B2Component module and power moduleSIEMENS AG·Filed 2016·Granted Aug 11, 2020·2 cites·17 claims
- 0962US11037862B2Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component moduleSIEMENS AG·Filed 2016·Granted Jun 15, 2021·2 cites·17 claims
- 1061US2023278078A1Medical Imaging Apparatus with a Functional Housing ShellSIEMENS HEALTHCARE GMBH·Filed 2023·Application pending·0 cites
- 1158US2025327858A1Testing of Electronic Assemblies and Electronic Assemblies Having a Device for TestingSIEMENS AG·Filed 2023·Application pending·0 cites
- 1253US12482739B2Arrangement for a semiconductor arrangement comprising at least one passive component and a substrateSIEMENS AG·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
- 1353US12082333B2Electronic module, method for producing an electronic module, and industrial plantSIEMENS AG·Filed 2021·Granted Sep 3, 2024·0 cites·9 claims
- 1451US2024416443A1Method for Producing a Solder Connection and Assembly with a Solder ConnectionSIEMENS AG·Filed 2022·Application pending·0 cites
- 1551US2025157878A1Electronics module comprising a pulsating heat pipe with a channel structureSIEMENS AG·Filed 2022·Application pending·0 cites
- 1649US2024414894A1Thermally conductive mountSIEMENS AG·Filed 2022·Application pending·0 cites
- 1747US2024379508A1Power Electronics AssemblySIEMENS AG·Filed 2022·Application pending·0 cites
- 1847US2024379484A1Electronics Assembly Comprising Circuit Carrier, Semiconductor Chip and Heat SinkSIEMENS AG·Filed 2022·Application pending·0 cites
- 1946US9972759B2Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stressOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted May 15, 2018·0 cites·19 claims
- 2044US2025118633A1Semiconductor arrangement comprising a semiconductor element with at least one connection elementSIEMENS AG·Filed 2023·Application pending·0 cites
- 2142US2023207516A1Method for Welding an Attachment Piece to a Semiconductor Metallisation by Laser WeldingSIEMENS AG·Filed 2021·Application pending·0 cites
- 2239US12183710B2Method for producing conductive tracks, and electronic moduleSIEMENS AG·Filed 2019·Granted Dec 31, 2024·0 cites·8 claims
- 2339US2022359342A1Securing power semiconductor components to curved surfacesROLLS ROYCE DEUTSCHLAND LTD & CO KG·Filed 2020·Application pending·0 cites
- 2439US2022254652A1Securing power semiconductor components to curved surfacesSIEMENS AG·Filed 2020·Application pending·0 cites
- 2538US9364863B2Method for forming an ultrasound transducer arraySTEGMEIER STEFAN·Filed 2013·Granted Jun 14, 2016·0 cites·15 claims
- 2637US2022301886A1Method for Thermally Spraying Conductor Paths, and Electronic ModuleSIEMENS AG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →