Inventor · disambiguated record
Stephan Stoeckl
Also filed as: STOECKL STEPHAN
10 granted patents·11 pending applications·14 citations·filing 2003–2023
81Inventor score
Top patents by PatentIndex Score
21 records- 0176US9368461B2Contact pads for integrated circuit packagesINTEL CORP·Filed 2014·Granted Jun 14, 2016·4 cites·23 claims
- 0275US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 0358US11018114B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL IP CORP·Filed 2019·Granted May 25, 2021·0 cites·25 claims
- 0457US2020328182A1Embedded-bridge substrate connectors and methods of assembling sameINTEL IP CORP·Filed 2020·Application pending·0 cites
- 0556US6940156B2Electronic module with a semiconductor chip which has flexible chip contacts, and method for producing the electronic moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 6, 2005·8 cites·18 claims
- 0655US2025112202A1Thermal interface material on a surface of a die in a cavityINTEL CORP·Filed 2023·Application pending·0 cites
- 0755US2025112139A1Vias through a die that are electrically isolated from active circuitry in the dieINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US2025112191A1Direct die-two-die connection through an interposer without viasINTEL CORP·Filed 2023·Application pending·0 cites
- 0954US2025210428A1Stiffener assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 1053US12057411B2Stress relief die implementationINTEL CORP·Filed 2019·Granted Aug 6, 2024·0 cites·25 claims
- 1152US2023317536A1Grooved packageINTEL CORP·Filed 2022·Application pending·0 cites
- 1251US11374323B2Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2017·Granted Jun 28, 2022·0 cites·15 claims
- 1351US2024332251A1Dummy silicon stiffening mechanism for module warpage mitigationINTEL CORP·Filed 2023·Application pending·0 cites
- 1448US10727197B2Embedded-bridge substrate connectors and methods of assembling sameINTEL IP CORP·Filed 2017·Granted Jul 28, 2020·0 cites·23 claims
- 1548US2023317705A1Thin client form factor assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 1647US10141265B2Bent-bridge semiconductive apparatusINTEL IP CORP·Filed 2016·Granted Nov 27, 2018·0 cites·22 claims
- 1743US7709936B2Module with carrier elementINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 4, 2010·0 cites·21 claims
- 1841US2019004083A1Smart accelerometer cantileverINTELL IP CORP·Filed 2017·Application pending·0 cites
- 1937US2019103347A1Electronic component alignment device and methodSEIDEMANN GEORG·Filed 2017·Application pending·0 cites
- 2036US7602614B2Electronic module and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 13, 2009·0 cites·17 claims
- 2135US2006088954A1Electronic component with cavity fillers made from thermoplast and method for production thereofBAUER MICHAEL·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →