Inventor · disambiguated record
Stefan Welsch
Also filed as: WELSCH STEFAN · WELSCH STEFAN T
6 granted patents·2 pending applications·3 citations·filing 2018–2024
70Inventor score
Top patents by PatentIndex Score
8 records- 0177US12083705B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2019·Granted Sep 10, 2024·2 cites·11 claims
- 0276US12479128B2Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline siliconSILTRONIC AG·Filed 2024·Granted Nov 25, 2025·0 cites·7 claims
- 0371US12381074B2Method, control system, and system for machining a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2023·Granted Aug 5, 2025·0 cites·15 claims
- 0465US11158549B2Method, control system and plant for processing a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2018·Granted Oct 26, 2021·1 cites·14 claims
- 0563US2025102430A1Sensor assembly, agricultural machine and associated methodDEERE & CO·Filed 2024·Application pending·0 cites
- 0658US2024365705A1Machine control system and method for analyzing agricultural materialDEERE & CO·Filed 2023·Application pending·0 cites
- 0752US11658022B2Method, control system, and system for machining a semiconductor wafer, and semiconductor waferSILTRONIC AG·Filed 2018·Granted May 23, 2023·0 cites·17 claims
- 0843US11770507B2Arrangement for data recording and sampling for an agricultural machineDEERE & CO·Filed 2022·Granted Sep 26, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →