Inventor · disambiguated record
Sunghawn Bae
Also filed as: BAE SUNGHAWN
6 granted patents·1 pending application·2 citations·filing 2019–2025
69Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0179US11393795B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 0272US11393767B2Semiconductor package and package-on-package devices including sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 0366US12243791B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·19 claims
- 0465US11881472B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0555US11342239B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 24, 2022·0 cites·15 claims
- 0645US2025385208A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0742US11152292B2Fan-out semiconductor package having metal pattern layer electrically connected embedded semiconductor chip and redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →