Inventor · disambiguated record
Suchet P. Chai
Also filed as: CHAI SUCHET P
2 granted patents·1 pending application·155 citations·filing 2000–2004
69Inventor score
Files withTELEDYNE TECH INC2
Top patents by PatentIndex Score
3 records- 0193US6828663B2Method of packaging a device with a lead frame, and an apparatus formed therefromTELEDYNE TECH INC·Filed 2001·Granted Dec 7, 2004·126 cites·22 claims
- 0286US6507110B1Microwave device and method for making sameTELEDYNE TECH INC·Filed 2000·Granted Jan 14, 2003·29 cites·24 claims
- 0337US2005023663A1Method of forming a packageFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →