Inventor · disambiguated record
Susan H. Chen
Also filed as: CHEN SUSAN · CHEN SUSAN H · CHEN SUSAN HSUCHING
22 granted patents·2 pending applications·482 citations·filing 1992–2004
96Inventor score
Top patents by PatentIndex Score
24 records- 0194US5726920AWatchdog system having data differentiating means for use in monitoring of semiconductor wafer testing lineADVANCED MICRO DEVICES INC·Filed 1995·Granted Mar 10, 1998·158 cites·47 claims
- 0287US6391750B1Method of selectively controlling contact resistance by controlling impurity concentration and silicide thicknessADVANCED MICRO DEVICES INC·Filed 2000·Granted May 21, 2002·43 cites·11 claims
- 0379US6461923B1Sidewall spacer etch process for improved silicide formationADVANCED MICRO DEVICES INC·Filed 2000·Granted Oct 8, 2002·27 cites·20 claims
- 0468US6660618B1Reverse mask and oxide layer deposition for reduction of vertical capacitance variation in multi-layer metallization systemsADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 9, 2003·15 cites·14 claims
- 0566US6368949B1Post-spacer etch surface treatment for improved silicide formationADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 9, 2002·13 cites·19 claims
- 0666US6114235AMultipurpose cap layer dielectricADVANCED MICRO DEVICES INC·Filed 1997·Granted Sep 5, 2000·32 cites·6 claims
- 0764US6117769APad structure for copper interconnection and its formationADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 12, 2000·24 cites·39 claims
- 0863US6346745B1Cu-A1 combined interconnect systemADVANCED MICRO DEVICES INC·Filed 1998·Granted Feb 12, 2002·28 cites·20 claims
- 0960US6159863AInsitu hardmask and metal etch in a single etcherADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 12, 2000·30 cites·7 claims
- 1056US6511904B1Reverse mask and nitride layer deposition for reduction of vertical capacitance variation in multi-layer metallization systemsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 28, 2003·7 cites·20 claims
- 1156US6383947B1Anti-reflective coating used in the fabrication of microcircuit structures in 0.18 micron and smaller technologiesADVANCED MICRO DEVICES INC·Filed 2000·Granted May 7, 2002·6 cites·10 claims
- 1255US6054384AUse of hard masks during etching of openings in integrated circuits for high etch selectivityADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 25, 2000·22 cites·8 claims
- 1354US6165855AAntireflective coating used in the fabrication of microcircuit structures in 0.18 micron and smaller technologiesADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 26, 2000·13 cites·2 claims
- 1453US2005089490A1Hair gels based on polymers having a low glass transition temperatureISP INVESTMENTS INC·Filed 2004·Application pending·0 cites
- 1550US6355575B1Semiconductor device and method of manufacturing without damaging HSQ layer and metal patternADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 12, 2002·3 cites·12 claims
- 1645US5468339APlasma etch processADVANCED MICRO DEVICES INC·Filed 1992·Granted Nov 21, 1995·14 cites·12 claims
- 1744US6331732B1Via structure in an integrated circuit utilizing a high conductivity metal interconnect and a method for manufacturing sameADVANCED MICRO DEVICES INC·Filed 1999·Granted Dec 18, 2001·9 cites·6 claims
- 1842US5468340AHighly selective high aspect ratio oxide etch method and products made by the processFiled 1993·Granted Nov 21, 1995·13 cites·8 claims
- 1941US6294396B1Monitoring barrier metal deposition for metal interconnectADVANCED MICRO DEVICES INC·Filed 1999·Granted Sep 25, 2001·8 cites·30 claims
- 2039US2002005582A1Pad structure for copper interconnection and its formationFiled 2000·Application pending·0 cites
- 2136US6268285B1Method of removing plasma etch damage to pre-silicidized surfaces by wet silicon etchADVANCED MICRO DEVICES INC·Filed 1999·Granted Jul 31, 2001·5 cites·11 claims
- 2235US6140706ASemiconductor device and method of manufacturing without damaging HSQ layer and metal pattern utilizing multiple dielectric layersADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 31, 2000·4 cites·7 claims
- 2335US5994206AMethod of forming a high conductivity metal interconnect using metal gettering plug and system performing the methodADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 30, 1999·4 cites·20 claims
- 2433US6071824AMethod and system for patterning to enhance performance of a metal layer of a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 6, 2000·4 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →