Inventor · disambiguated record
Sungdong Cho
Also filed as: CHO SUNGDONG
15 granted patents·6 pending applications·9 citations·filing 2014–2025
86Inventor score
Top patents by PatentIndex Score
21 records- 0193US11735498B2Through via electrode and device isolation structure including oxide layer pattern and nitride layer pattern sequentially stacked on inner surface of trenchSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·4 cites·19 claims
- 0290US11380606B2Semiconductor device including via structure with head and body portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·18 claims
- 0381US11791242B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·1 cites·20 claims
- 0480US2025096141A1Semiconductor memory device including wiring contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0575US12183680B2Semiconductor memory device including wiring contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0675US11901297B2Semiconductor memory device including wiring contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 0774US2025087531A1Semiconductor chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0870US11569171B2Semiconductor memory device including wiring contact plugsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 0968US11832184B2System and method for exchanging data or signals for vehicleLG ELECTRONICS INC·Filed 2018·Granted Nov 28, 2023·1 cites·12 claims
- 1068US2025266348A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1166US12334438B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1266US11798866B2Semiconductor device including via structures with undercut portions and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1361US12176245B2Semiconductor chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 24, 2024·0 cites·16 claims
- 1461US2023178434A1Semiconductor device, semiconductor package, and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1559US11990450B2Device including first structure having peripheral circuit and second structure having gate layersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·19 claims
- 1657US11848285B2Semiconductor chip including buried dielectric pattern at edge region, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1754US2024215229A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1852US12500189B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
- 1948US12096319B2Method by which first device transmits message in wireless communication system supporting sidelink, and device thereforLG ELECTRONICS INC·Filed 2020·Granted Sep 17, 2024·0 cites·14 claims
- 2046US11705379B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 2141US2015145124A1Semiconductor chips with through-silicon vias, and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →