Inventor · disambiguated record
Sungwon Cho
Also filed as: CHO SUNGWON
63 granted patents·25 pending applications·250 citations·filing 2009–2025
98Inventor score
Files withSAMSUNG DISPLAY CO LTD28STATS CHIPPAC PTE LTD20SAMSUNG ELECTRONICS CO LTD12CHO SUNGWON9STATS CHIPPAC LTD7
Top patents by PatentIndex Score
88 records- 0196US11456338B2Display panel with color control layer including wall bases having reflective layers on sidewalls thereofSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·19 claims
- 0296US8502387B2Integrated circuit packaging system with vertical interconnection and method of manufacture thereofCHOI DAESIK·Filed 2010·Granted Aug 6, 2013·48 cites·20 claims
- 0395US11935840B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2022·Granted Mar 19, 2024·2 cites·23 claims
- 0495US11444035B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 13, 2022·3 cites·25 claims
- 0595US10784210B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2018·Granted Sep 22, 2020·11 cites·21 claims
- 0695US8409979B2Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection propertiesCHOI DAESIK·Filed 2011·Granted Apr 2, 2013·17 cites·17 claims
- 0793US10985109B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2018·Granted Apr 20, 2021·10 cites·25 claims
- 0892US11784133B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2020·Granted Oct 10, 2023·2 cites·25 claims
- 0992US11088082B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2018·Granted Aug 10, 2021·7 cites·23 claims
- 1092US10804217B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2019·Granted Oct 13, 2020·6 cites·22 claims
- 1192US8492197B2Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrateCHO SUNGWON·Filed 2010·Granted Jul 23, 2013·14 cites·31 claims
- 1291US8273604B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2011·Granted Sep 25, 2012·17 cites·22 claims
- 1390US11342278B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 24, 2022·2 cites·23 claims
- 1490US11087278B1Computerized systems and methods for managing inventory by grading returned productsCOUPANG CORP·Filed 2021·Granted Aug 10, 2021·4 cites·20 claims
- 1590US8519544B2Semiconductor device and method of forming WLCSP structure using protruded MLPKIM OHHAN·Filed 2012·Granted Aug 27, 2013·13 cites·25 claims
- 1690US8288203B2Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bumpCHO SUNGWON·Filed 2011·Granted Oct 16, 2012·12 cites·20 claims
- 1789US10910322B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2018·Granted Feb 2, 2021·4 cites·19 claims
- 1888US11355452B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 7, 2022·2 cites·24 claims
- 1988US11211534B2Display device and method of fabricating the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Dec 28, 2021·6 cites·23 claims
- 2088US9997468B2Integrated circuit packaging system with shielding and method of manufacturing thereofSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jun 12, 2018·5 cites·20 claims
- 2188US8709935B2Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection propertiesSTATS CHIPPAC LTD·Filed 2013·Granted Apr 29, 2014·7 cites·21 claims
- 2287US9373578B2Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection propertiesSTATS CHIPPAC LTD·Filed 2014·Granted Jun 21, 2016·6 cites·26 claims
- 2386US10388611B2Semiconductor device and method of forming magnetic field shielding with ferromagnetic materialSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·8 cites·21 claims
- 2485US8574964B2Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tapeCHO SUNGWON·Filed 2010·Granted Nov 5, 2013·7 cites·25 claims
- 2584US12211804B2Semiconductor device with partial EMI shielding removal using laser ablationSTATS CHIPPAC PTE LTD·Filed 2024·Granted Jan 28, 2025·0 cites·25 claims
- 2684US11422654B2Input detection unit and electronic device including sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Aug 23, 2022·1 cites·20 claims
- 2782US12341108B2Shielded semiconductor package with open terminal and methods of makingSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jun 24, 2025·0 cites·13 claims
- 2882US10969889B2Electronic apparatus and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2019·Granted Apr 6, 2021·2 cites·20 claims
- 2980US8835301B2Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor waferCHOI JOONYOUNG·Filed 2011·Granted Sep 16, 2014·5 cites·25 claims
- 3079US2025366319A1Display device and method of manufacturing the display deviceSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 3178US2025017054A1Display device and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 3277US2024276758A1Window module and method of manufacturing display deviceSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 3376US11758788B2Method of manufacturing display panel with color control layer including wall bases having reflective layers on sidewalls thereofSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·12 claims
- 3476US11715703B2EMI shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Aug 1, 2023·0 cites·23 claims
- 3576US8502391B2Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpagePARK HYUNG SANG·Filed 2011·Granted Aug 6, 2013·4 cites·25 claims
- 3676US8173536B2Semiconductor device and method of forming column interconnect structure to reduce wafer stressCHO SUNGWON·Filed 2009·Granted May 8, 2012·6 cites·27 claims
- 3775US9324659B2Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower dieCHO SUNGWON·Filed 2011·Granted Apr 26, 2016·4 cites·23 claims
- 3873US11450610B2Vertical semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 20, 2022·1 cites·20 claims
- 3971US2025048853A1Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4070US12369463B2Display device and method of manufacturing the display deviceSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·11 claims
- 4170US11688697B2Emi shielding for flip chip package with exposed die backsideSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 27, 2023·0 cites·21 claims
- 4269US2025102904A1Mask and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4369US2025151600A1Mask assembly and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4468US12369462B2Display apparatus and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 4568US12288753B2Semiconductor device with partial EMI shielding and method of making the sameSTATS CHIPPAC PTE LTD·Filed 2021·Granted Apr 29, 2025·0 cites·18 claims
- 4668US11985843B2Window module and method of manufacturing display deviceSAMSUNG DISPLAY CO LTD·Filed 2021·Granted May 14, 2024·0 cites·18 claims
- 4768US2025115987A1Mask assembly and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 4868US2025240963A1Memory device and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4966US12127444B2Display device and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·6 claims
- 5066US11728281B2Shielded semiconductor packages with open terminals and methods of making via two-step processSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 15, 2023·0 cites·25 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →