Inventor · disambiguated record
Sung Wook Chun
Also filed as: CHUN SUNG W · CHUN SUNG WOOK
9 granted patents·9 pending applications·55 citations·filing 1994–2023
83Inventor score
Top patents by PatentIndex Score
18 records- 0187US9758889B2Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured therebyYMT CO LTD·Filed 2014·Granted Sep 12, 2017·5 cites·7 claims
- 0282US5514643A2-aminothiazolecarboxamide derivatives, processes for preparing the same and use thereof for controlling phytopathogenic organismsLUCKY LTD·Filed 1994·Granted May 7, 1996·31 cites·14 claims
- 0378US8759986B2Substrate structure and method of manufacturing the sameLEE CHUL MIN·Filed 2011·Granted Jun 24, 2014·4 cites·6 claims
- 0473US12495494B2Metal foil, carrier with metal foil comprising the same and printed circuit board including the sameYMT CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·7 claims
- 0567US6475299B1Conversion coating composition based on nitrogen and silicon compounds and conversion coating method using the sameSAMSUNG ELECTRO MECH·Filed 2000·Granted Nov 5, 2002·14 cites·23 claims
- 0658US2024174812A1Leveling agent and electroplating composition for forming circuit pattern including the sameYMT CO LTD·Filed 2022·Application pending·0 cites
- 0757US2025031316A1Methods for forming circuit pattern on substrate using metal foil with low surface roughnessYMT CO LTD·Filed 2023·Application pending·0 cites
- 0855US12408279B2Release layer for metal foil with carrier and metal foil comprising the sameYMT CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·8 claims
- 0950US11499233B2Plated laminate and printed circuit boardYMT CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·6 claims
- 1049US12139811B2Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the sameYMT CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·3 claims
- 1149US11028495B2Method for producing porous copper foil and porous copper foil produced by the sameYMT CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·3 claims
- 1249US2010155108A1Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1348US2014098504A1Electroplating method for printed circuit boardYMT CO LTD·Filed 2012·Application pending·0 cites
- 1448US2024133039A1Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Application pending·0 cites
- 1544US2023203693A1Surface modifier for electrolytic nickel plating and nickel electroplating solution including the sameYMT CO LTD·Filed 2021·Application pending·0 cites
- 1641US2024260200A1Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminateYMT CO LTD·Filed 2022·Application pending·0 cites
- 1740US2007104929A1Method for plating printed circuit board and printed circuit board manufactured therefromYMT CO LTD·Filed 2006·Application pending·0 cites
- 1837US2003194485A1Alloy plating solution for surface treatment of modular printed circuit boardFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →