Inventor · disambiguated record
Sunao Fukutake
Also filed as: FUKUTAKE SUNAO
12 granted patents·1 pending application·241 citations·filing 1988–2024
91Inventor score
Files withJAPAN GORE TEX INC5MURATA MANUFACTURING CO4FURUKAWA ELECTRIC CO LTD2GORE & ASS1HITACHI MAXELL1
Top patents by PatentIndex Score
13 records- 0182US5473118APrinted circuit board with a coverlay filmJAPAN GORE TEX INC·Filed 1994·Granted Dec 5, 1995·58 cites·14 claims
- 0281US11365353B2Black liquid-crystal polymer film and multilayer boardMURATA MANUFACTURING CO·Filed 2019·Granted Jun 21, 2022·2 cites·21 claims
- 0375US5061990ASemiconductor device and the manufacture thereofHITACHI MAXELL·Filed 1988·Granted Oct 29, 1991·50 cites·8 claims
- 0472US10959330B2Metal-clad laminate, circuit board, and multilayer circuit boardMURATA MANUFACTURING CO·Filed 2019·Granted Mar 23, 2021·1 cites·20 claims
- 0568US5252383ACarrier sheet for printed circuits and semiconductor chipsJAPAN GORE TEX INC·Filed 1992·Granted Oct 12, 1993·43 cites·5 claims
- 0668US5116663ACeramic substrate material containing an amorphous fluorine resinGORE & ASS·Filed 1990·Granted May 26, 1992·43 cites·4 claims
- 0768US2024359445A1Multilayer substrateMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0863US11680332B2Surface-treated copper foil, and copper-clad laminate and circuit board using sameFURUKAWA ELECTRIC CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·10 claims
- 0959US10701811B2Surface-treated copper foil, and copper-clad laminate and printed wiring board using sameFURUKAWA ELECTRIC CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 1050US12167545B2Multilayer substrateMURATA MANUFACTURING CO·Filed 2022·Granted Dec 10, 2024·0 cites·19 claims
- 1150US5294487AComposite layered material containing a silicone resin substrateJAPAN GORE TEX INC·Filed 1993·Granted Mar 15, 1994·16 cites·3 claims
- 1246US5580618ALCD article from liquid crystal filled, hydrophilically-coated, porous PTFE filmJAPAN GORE TEX INC·Filed 1995·Granted Dec 3, 1996·11 cites·13 claims
- 1344US5446315AResin-sealed semiconductor device containing porous fluorocarbon resinJAPAN GORE TEX INC·Filed 1994·Granted Aug 29, 1995·17 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →