Inventor · disambiguated record
Suji Gim
Also filed as: GIM SUJI
7 granted patents·2 pending applications·0 citations·filing 2021–2025
68Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0176US2025352949A1Apparatus and method of trapping an exhaust material from a substrate-processing process and apparatus for processing a substrate including the trapping apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0272US12409404B2Scrubber system and wet cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·11 claims
- 0363US12431340B2Exhaust gas processing apparatus having plasma source and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 0462US12390763B2Apparatus trapping an exhaust material from a substrate-processing process and apparatus for processing a substrate including the trapping apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·18 claims
- 0555US11931683B2Scrubber system and wet cleaning method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0654US2024124979A1Semiconductor manufacturing apparatus, gas supplying method using the same, and semiconductor manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0753US11549178B2Apparatus for treating semiconductor process gas and method of treating semiconductor process gasSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 0849US11660563B2Apparatus for collecting by-product and method for collecting by-productSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 0940US11738299B2Exhaust gas processing system including adsorbent for suppressing powder-like byproductSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →