Inventor · disambiguated record
Sumio Hokari
Also filed as: HOKARI SUMIO
2 granted patents·1 pending application·3 citations·filing 2006–2016
38Inventor score
Top patents by PatentIndex Score
3 records- 0165US10074757B2Semiconductor package, sensor module, and production methodSONY CORP·Filed 2015·Granted Sep 11, 2018·3 cites·16 claims
- 0234US10546888B2Solid-state imaging device package and manufacturing method, and electronic apparatusSONY CORP·Filed 2016·Granted Jan 28, 2020·0 cites·4 claims
- 0329US2006157865A1Circuit board and manufacturing method therefor and semiconductor package and manufacturing method thereforHOKARI SUMIO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →