Inventor · disambiguated record
Sung-Bok Hong
Also filed as: HONG SUNG BOK
9 granted patents·2 pending applications·176 citations·filing 1996–2019
87Inventor score
Top patents by PatentIndex Score
11 records- 0186US8672210B2Capillary exchange system of semiconductor wire bondingSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Mar 18, 2014·12 cites·17 claims
- 0281US5765277ADie bonding apparatus with a revolving pick-up toolSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jun 16, 1998·65 cites·10 claims
- 0379US5979739ASemiconductor die bonding apparatus having multiple bonding systemSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Nov 9, 1999·59 cites·14 claims
- 0477US6863109B2In-line die attaching and curing apparatus for a multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 8, 2005·25 cites·19 claims
- 0562US7074646B2In-line die attaching and curing apparatus for a multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 11, 2006·10 cites·17 claims
- 0641US11011395B2Cover structure for a light source, light illuminating apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 18, 2021·0 cites·14 claims
- 0740US11081374B2Semiconductor package molding device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 0839US2013056448A1Wire bonding system for semiconductor packageKIM DOO-JIN·Filed 2012·Application pending·0 cites
- 0935US8905290B2Apparatus for mounting semiconductor chips on a circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 9, 2014·0 cites·13 claims
- 1030US6187121B1Die-bonding equipment and a method for detecting residual adhesive material using the sameSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·5 cites·23 claims
- 1126US2001002569A1Apparatus for cutting adhesive tape mounted on semiconductor waferFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →