Inventor · disambiguated record
Suk Youn Hong
Also filed as: HONG SUK-YOUN
13 granted patents·2 pending applications·23 citations·filing 2006–2020
87Inventor score
Top patents by PatentIndex Score
15 records- 0191US10564679B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 18, 2020·5 cites·20 claims
- 0290US11347273B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2020·Granted May 31, 2022·2 cites·33 claims
- 0389US10629542B2Electronic device moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 21, 2020·7 cites·18 claims
- 0484US11114358B2Semi-conductor packageSAMSUNG ELECTRO MECH·Filed 2020·Granted Sep 7, 2021·2 cites·19 claims
- 0581US11209872B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 28, 2021·2 cites·16 claims
- 0673US7872266B2Semiconductor light emitting diode and method for manufacturing the sameSAMSUNG LED CO LTD·Filed 2006·Granted Jan 18, 2011·4 cites·11 claims
- 0772US10897811B2Electronic device moduleSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 19, 2021·1 cites·20 claims
- 0864US11252812B2Electronic device moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 15, 2022·0 cites·14 claims
- 0955US11430742B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 30, 2022·0 cites·17 claims
- 1052US8716043B2Method for manufacturing semiconductor light emitting diodeCHOI PUN JAE·Filed 2010·Granted May 6, 2014·0 cites·15 claims
- 1151US10937710B2Electronic component moduleSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 2, 2021·0 cites·19 claims
- 1250US11251135B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 15, 2022·0 cites·18 claims
- 1350US10991658B2Electronic element module and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Apr 27, 2021·0 cites·19 claims
- 1441US2008211083A1Electronic package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1534US2017243832A1Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →